Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
GSD090144HR

GSD090144HR

Storage & Server IO (Amphenol ICC)

SD CARD PUSH-PUSH TYPE

300

7334L2622F02LF

7334L2622F02LF

Storage & Server IO (Amphenol ICC)

CONN SMART CARD PUSH-PULL R/A

0

KP10S-SF-PEJ(812)

KP10S-SF-PEJ(812)

Hirose

CONN MICRO SIM CARD

0

10067847-001TLF

10067847-001TLF

Storage & Server IO (Amphenol ICC)

CONN SD CARD PUSH-PUSH SMD

0

G85B231020B1HR

G85B231020B1HR

Storage & Server IO (Amphenol ICC)

MICRO SIM PUSH/PUSH 30U"

0

IC1GA-68PD-1.27DS-EJ(72)

IC1GA-68PD-1.27DS-EJ(72)

Hirose

CONN CARD PUSH-PUSH R/A PCB R/A

0

CCM01-2634 LFT T25

CCM01-2634 LFT T25

C&K

LOW PROFILE SMART CARD CONN

0

MI21-50PD-SF-EJR(91)

MI21-50PD-SF-EJR(91)

Hirose

CONN COM FLASH TYPE I & II SMT

0

MI21A-50PD-SF-EJL(91)

MI21A-50PD-SF-EJL(91)

Hirose

CONN COM FLASH TYPE I & II SMT

0

7312S0825X19LF

7312S0825X19LF

Storage & Server IO (Amphenol ICC)

CONN SIM/SAM CARD HINGED TYPE

747

1510580001

1510580001

Woodhead - Molex

MICRO BLOCK SIM CONN INSERT MOLD

0

0785450010

0785450010

Woodhead - Molex

2.54 SIM CARD CONN .3MM

0

N7E50-D516PG-30-WF

N7E50-D516PG-30-WF

3M

CONN COMPACT FLASH CARD R/A SMD

0

G85B231021B1HR

G85B231021B1HR

Storage & Server IO (Amphenol ICC)

G85B231021B1HR

0

DM3ND-SF-PEJ(800)

DM3ND-SF-PEJ(800)

Hirose

CONN SD CARD PUSH-PUSH

0

101009586802

101009586802

Storage & Server IO (Amphenol ICC)

SD PUSH PUSH

0

FCF-140-02-S-D-02-SL

FCF-140-02-S-D-02-SL

Samtec, Inc.

.050" FLEX CARD TERMINAL

0

GTF4P17131HR

GTF4P17131HR

Storage & Server IO (Amphenol ICC)

MICRO SD 4.0, P=0.9MM H=1.45 , N

1200

C70210M0085012

C70210M0085012

Tuchel / Amphenol

CONN SMART CARD PUSH-PULL

0

CCM04-5427LFT R901

CCM04-5427LFT R901

C&K

CONN SMART CARD PUSH-PULL R/A

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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