Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
MQ198-P-1.5DV

MQ198-P-1.5DV

Hirose

CONN MEMORY CARD

0

7312S0825X01LF

7312S0825X01LF

Storage & Server IO (Amphenol ICC)

SIM CARD CNR LF S08

0

10067099-500LF

10067099-500LF

Storage & Server IO (Amphenol ICC)

T-FLASH 2.65H WITH DETEC

0

G85D1140022P1HR

G85D1140022P1HR

Storage & Server IO (Amphenol ICC)

NANOSIM 6 POS, GF

0

GT22MM-ETC400

GT22MM-ETC400

Hirose

ETC CARD HOLDER

0

CFS-125-02-L-D-RA-02-SL

CFS-125-02-L-D-RA-02-SL

Samtec, Inc.

.050 X .050 EDGE MOUNT SOCKET AS

0

ST50S017VCAR1800

ST50S017VCAR1800

JAE Electronics

CONN MICRO SD CARD PUSH-PUSH SMD

1091

GSD09002SEU

GSD09002SEU

Storage & Server IO (Amphenol ICC)

CONN MICRO SD CARD PUSH-PUSH

0

G85C11101152HHR

G85C11101152HHR

Storage & Server IO (Amphenol ICC)

SMART CARD

0

7334L2620F05LF

7334L2620F05LF

Storage & Server IO (Amphenol ICC)

SMARTCARD CNR L26 F05 LF

0

C702 10M008 7022

C702 10M008 7022

Tuchel / Amphenol

CONN SMART CARD PUSHMATIC

0

0473092285

0473092285

Woodhead - Molex

MICRO SD HEADER WITH D/C PIN

0

CCM01-2555LFT T25

CCM01-2555LFT T25

C&K

LOW PROFILE SMART CARD CONN

0

C70210M0083254

C70210M0083254

Tuchel / Amphenol

CONN SMARTCARD

0

N7E50-A516PK-30-WF

N7E50-A516PK-30-WF

3M

CONN COMPACT FLASH CARD R/A SMD

0

C702 10M008 0393

C702 10M008 0393

Tuchel / Amphenol

CONN SMARTCARD

0

JC26A-BB-E1050E

JC26A-BB-E1050E

JAE Electronics

CONN COMPACT FLASH CARD R/A SMD

0

GTFP08432B1HR

GTFP08432B1HR

Storage & Server IO (Amphenol ICC)

MICRO SD 5U"

0

0912283005

0912283005

Woodhead - Molex

CONN SIM CARD PUSH-PUSH R/A SMD

0

JC26C2-DSL16E

JC26C2-DSL16E

JAE Electronics

CONN COMPACT FLASH CARD SNAP-IN

0

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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