Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
PJS008-2120-0

PJS008-2120-0

Yamaichi Electronics

MICROSD, PUSH-PUSH, STD MOUNT, S

50

CCM03-3009LFT R102

CCM03-3009LFT R102

C&K

CONN SIM/SAM CARD HINGED TYPE

5474

CCM01-2623 LFT T25 AE

CCM01-2623 LFT T25 AE

C&K

LOW PROFILE SMART CARD CONN

0

MSCCP-D-08-SG-SW-T/R

MSCCP-D-08-SG-SW-T/R

Adam Tech

MINI SIM CARD CONNECTOR

923

IC1F-68RD-1.27SH(52)

IC1F-68RD-1.27SH(52)

Hirose

CONN PCMCIA CARD PUSH-PULL

0

IC9-68RD-0.635SFA(51)

IC9-68RD-0.635SFA(51)

Hirose

CONN PC CARD

0

5045200691

5045200691

Woodhead - Molex

NANO-SIM CARD CONNECTOR, PIN-EJE

12284

MEM2067-02-180-00-A

MEM2067-02-180-00-A

Global Connector Technology, Limited (GCT)

MICRO SD HINGED, SMT, 1.80MM PRO

0

SIM4065-8-1-15-00-A

SIM4065-8-1-15-00-A

Global Connector Technology, Limited (GCT)

MINI SIM PUSH-PUSH, 8P, SMT, 1.6

3475

CCM01-2663 LFT T25

CCM01-2663 LFT T25

C&K

LOW PROFILE SMART CARD CONN

187

1042391430

1042391430

Woodhead - Molex

MSD/NSIM COMBO 2.05H PULLER TYPE

5257

0475500001

0475500001

Woodhead - Molex

CONN SIM CARD BLOCK STYLE SMD

17364

C70210M0080654

C70210M0080654

Tuchel / Amphenol

CONN SMARTCARD PUSH-PULL 8POS

0

055036006202862+

055036006202862+

KYOCERA Corporation

CONN SIM CARD PUSH-PUSH R/A SMD

2403

IC1F-68RD-1.27SFA(52)

IC1F-68RD-1.27SFA(52)

Hirose

CONN PCMCIA CARD PUSH-PULL SMD

0

SF72S006VBAR2500

SF72S006VBAR2500

JAE Electronics

CONN NANO SIM CARD PUSH-PUSH

0

10067847-011RLF

10067847-011RLF

Storage & Server IO (Amphenol ICC)

CONN SD CARD PUSH-PUSH SMD

3451

PJS008-4100-0-VE

PJS008-4100-0-VE

Yamaichi Electronics

AUTOMOTIVE PUSH-LOCK MICRO SD CA

50

JC26E-BBE

JC26E-BBE

JAE Electronics

CONN COMPACT FLASH CARD R/A SMD

0

10055262-100BBTLF

10055262-100BBTLF

Storage & Server IO (Amphenol ICC)

CONN PCMCIA CARD PUSH-PULL R/A

80

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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