Memory Connectors - PC Card Sockets

Image Part Number Description / PDF Quantity Rfq
5031821852

5031821852

Woodhead - Molex

MICRO SD NORMAL ULTRALOWPRO8CKTE

25526

693071020811

693071020811

Würth Elektronik Midcom

SMT MICRO SD CARD CONNECTOR, PUS

610

MI20A-50PD-SF-EJR(71)

MI20A-50PD-SF-EJR(71)

Hirose

CONN COMPACT FLASH CARD

54

7361E0525S05LF

7361E0525S05LF

Storage & Server IO (Amphenol ICC)

CONN SMART CARD PUSH-PULL

286

009162006216175

009162006216175

Elco (AVX)

CONN SIM CARD PUSH-PULL R/A SMD

3127

N7E50-M516RB-40

N7E50-M516RB-40

3M

CONN COMPACT FLASH CARD R/A SMD

4109

7E50-B316-04

7E50-B316-04

3M

CONN COMPACT FLASH CARD

2547

7334L2622F04LF

7334L2622F04LF

Storage & Server IO (Amphenol ICC)

CONN SMART CARD PUSH-PULL R/A

0

FPS009-2920-0

FPS009-2920-0

Yamaichi Electronics

SD/MMCCARD PUSH-PUSH, W/ CARD D

50

5535655-1

5535655-1

TE Connectivity AMP Connectors

CONN PCMCIA CARD PUSH-PULL R/A

55

JC26A-BB16E

JC26A-BB16E

JAE Electronics

CONN COMPACT FLASH CARD R/A SMD

26

1051620101

1051620101

Woodhead - Molex

1.45H MICRO SD HEADER WITH D/C P

2135

145638109511859+

145638109511859+

KYOCERA Corporation

CONN SD CARD PUSH-PUSH R/A SMD

5251

145638009511859+

145638009511859+

KYOCERA Corporation

CONN SD CARD PUSH-PUSH R/A SMD

439

N7E50-N516RB-40-WF

N7E50-N516RB-40-WF

3M

CONN COMPACT FLASH CARD R/A SMD

803

315610050550871+

315610050550871+

KYOCERA Corporation

CONN COMPACT FLASH CARD R/A SMD

1143

SIM5055-6-1-25-00-A

SIM5055-6-1-25-00-A

Global Connector Technology, Limited (GCT)

MINI SIM HINGED, 6P, SMT, 2.5MM

15

N7E50-Q516RB-50-WF

N7E50-Q516RB-50-WF

3M

CONN COMPACT FLASH CARD R/A SMD

1627

5953398-1

5953398-1

TE Connectivity AMP Connectors

CONN SMART CARD PUSH-PULL R/A

108

MEM2061-01-188-00-A

MEM2061-01-188-00-A

Global Connector Technology, Limited (GCT)

MICRO SD PUSH PUSH, CLOSED, SMT,

454

Memory Connectors - PC Card Sockets

1. Overview

PC Card Sockets (Personal Computer Memory Card International Association Sockets) are standardized expansion interfaces for connecting peripheral devices to computing systems. Defined by the PCMCIA standard, these connectors enable hot-swappable integration of memory modules, storage devices, network adapters, and other functional components. Their compact form factor and universal compatibility have made them critical in portable electronics, industrial equipment, and embedded systems.

2. Main Types and Functional Classification

TypePhysical Dimensions (mm)Functional FeaturesApplication Examples
Type I54 85.6 3.316-bit ISA bus, 68-pinMemory expansion cards
Type II54 85.6 5.016/32-bit bus supportModem, LAN adapters
Type III54 85.6 10.532-bit CardBus interfaceHard disk drives
ExpressCard54 75 5.0 or 34 75 5.0PCIe/GPIO interface, 26-pinHigh-speed SSD interfaces

3. Structure and Components

Typical PC card sockets consist of:

  • Dielectric Housing: High-temperature resistant LCP material
  • Contact Array: Gold-plated phosphor bronze contacts (10-30 m plating)
  • Actuation Mechanism: Ejector levers with tactile feedback
  • Locking System: Mechanical retention springs
  • EMI Shielding: Integrated metal cans (0.1-0.3mm thickness)
The contact pitch typically measures 1.27mm with 0.8mm contact spacing, supporting blind-mating designs.

4. Key Technical Specifications

ParameterTypical ValueImportance
Contact Resistance10-30m Signal integrity maintenance
Current Rating1.0A per contactPower delivery capability
Dielectric Withstand1000VACElectrical safety compliance
Operating Temperature-55 C to +85 CEnvironmental reliability
Mating Cycles10,000+Durability indicator

5. Application Fields

Primary industries include:

  • Consumer Electronics: Notebook computers, digital cameras
  • Industrial Automation: Programmable logic controllers (PLCs)
  • Medical Devices: Portable diagnostic equipment
  • Telecommunications: Wireless base stations
  • Military/Aerospace: Ruggedized computing systems
Case Example: Siemens industrial PCs use Type III sockets for CFast storage modules in factory automation systems.

6. Leading Manufacturers and Products

ManufacturerKey Product SeriesTechnical Features
Amphenol ICC515 SeriesLow-profile Type II sockets
Molex47220 SeriesCardBus compatible
TE Connectivity1-1461885ExpressCard 34mm design
SamtecASP-200404High-speed differential pairs

7. Selection Guidelines

Key considerations:

  • Interface Compatibility: Match bus type (16-bit/32-bit/CardBus/PCIe)
  • Current Capacity: Verify power requirements (e.g., 3.3V/5V support)
  • Vibration Resistance: Select locking mechanisms for mobile applications
  • Thermal Management: Evaluate current carrying capacity under load
  • RoHS Compliance: Confirm lead-free termination options
Best Practice: For industrial applications, specify extended temperature (-40 C to +85 C) socket designs.

8. Industry Trends

Current development directions:

  • Miniaturization: Transition from PCMCIA to ExpressCard/USB4 form factors
  • Speed Enhancement: Support for PCIe Gen4 (16GT/s) protocols
  • Multi-functionality: Integrated power/signal contacts
  • Material Innovation: Graphene-enhanced contact plating
  • Standard Evolution: Migration towards USB4/Thunderbolt compatibility
Market forecasts predict sustained demand in industrial sectors despite consumer market decline.

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