Memory Connectors - Accessories

Image	Part Number	Description / PDF	Quantity	Rfq
	83808-22011 Storage & Server IO (Amphenol ICC)	C SH TI CLOSED	0
	83808-20010SLF Storage & Server IO (Amphenol ICC)	C SH TII CLOSED INS	0
	83808-21110 Storage & Server IO (Amphenol ICC)	C SH TII 1 I/O REC INS	0
	83808-21011LF Storage & Server IO (Amphenol ICC)	C SH TII 1 I/O CARDBUS	0
	10029520-001 Storage & Server IO (Amphenol ICC)	COLT & RICOLA TOP SHIELD	0
	95121-001 Storage & Server IO (Amphenol ICC)	CONN PCMCIA CARD	0
	78242-002 Storage & Server IO (Amphenol ICC)	LATCH FOR FLYING	0
	57924-001 Storage & Server IO (Amphenol ICC)	SHIELD PLUS FRAME PLUS INSULATOR	0
	95121-003 Storage & Server IO (Amphenol ICC)	PCMCIA THREADED SCREW	0
	83818-20101LF Storage & Server IO (Amphenol ICC)	C SH 5MM OE REC CB	0
	83808-21110S Storage & Server IO (Amphenol ICC)	C SH TII 1 I/O REC INS	0
	92791-051 Storage & Server IO (Amphenol ICC)	PCMCIA MECHANISM	0
	92791-043 Storage & Server IO (Amphenol ICC)	PCMCIA MECHANISM	0
	83808-20010LF Storage & Server IO (Amphenol ICC)	C SH TII CLOSED INS	0
	62197-003 Storage & Server IO (Amphenol ICC)	CF CARD KIT SEMI	0
	83808-20110SLF Storage & Server IO (Amphenol ICC)	CARD SHIELD	0
	83808-21001 Storage & Server IO (Amphenol ICC)	C SH TII 1 I/O CARDBUS	0
	83808-20000SLF Storage & Server IO (Amphenol ICC)	C SH TII CLOSED	0
	83808-22100LF Storage & Server IO (Amphenol ICC)	PCMCIA T2 V2 ROCARD SHIELD	0
	10017657-20111 Storage & Server IO (Amphenol ICC)	SHIELD PLUS FRAME PLUS INSULATOR	0

Memory Connectors - Accessories

1. Overview

Memory connectors and accessories are critical components that enable electrical and mechanical connections between memory modules (e.g., RAM, SSDs) and host systems. They ensure reliable signal transmission, power delivery, and mechanical stability in electronic devices. With advancements in computing performance and miniaturization trends, these components have become essential in applications ranging from consumer electronics to industrial systems.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
DIMM Connectors	64-bit data path, ZIF (Zero Insertion Force) design	Desktop PCs, Servers
SO-DIMM Connectors	Smaller form factor, 200/260-pin configurations	Laptops, Embedded Systems
U-DIMM Connectors	Unbuffered memory support, low-latency performance	Gaming PCs, Workstations
SIMM Connectors	32-bit data path, legacy technology	Older Servers, Industrial Equipment
RIMM Connectors	RDRAM-compatible, high-speed signaling	Legacy High-Performance Computing

3. Structure & Components

Typical memory connectors consist of:

Contact pins (phosphor bronze with gold plating for conductivity)
Insulating housing (LCP/LPA material for thermal stability)
Actuator mechanism (for ZIF connectors)
EMI shielding (for high-frequency applications)
Retention clips (mechanical stabilization)

4. Key Technical Specifications

Parameter	Value/Range	Importance
Contact Resistance	5-20 m	Affects signal integrity
Current Rating	1-3 A/pin	Determines power capacity
Dielectric Withstanding Voltage	500 VAC	Safety and reliability
Operating Temperature	-55 C to +125 C	Environmental durability
Insertion Force	20-50N	Affects lifespan
Signal Integrity	Supports up to 8 GT/s	Enables high-speed memory

5. Application Fields

Computer Hardware: Motherboards, Graphics Cards
Data Centers: Servers, Storage Arrays
Consumer Electronics: Smartphones, Tablets
Industrial Equipment: Automation Controllers
Telecommunications: Routers, Base Stations

6. Leading Manufacturers & Products

Manufacturer	Representative Products
TE Connectivity	DDR4 DIMM Connectors, SATA Power Connectors
Amphenol ICC	High-Speed SO-DIMM Sockets
Molex	DDR5 U-DIMM Connectors
Samtec	High-Frequency Memory Arrays
JAE Electronics	Compact R-DIMM Solutions

7. Selection Guidelines

Key factors to consider:

Compatibility with memory standard (DDR3/DDR4/DDR5)
Environmental requirements (temperature, vibration)
Electrical performance requirements
Space constraints (form factor limitations)
Cost vs. reliability trade-offs
Compliance with industry standards (JEDEC, IPC)

8. Industry Trends Analysis

Current development trends include:

Transition to DDR5/LPDDR5X standards with 8 GT/s+ data rates
Miniaturization for mobile and IoT applications
Integrated power delivery (Power & Signal in single connector)
Advanced thermal management solutions
Increased use of press-fit terminations
Development of optical memory interconnects

Application Case: In high-density servers, TE Connectivity's DDR4 connectors enable 3200 MT/s memory speeds while maintaining signal integrity below 12 m resistance. For automotive applications, Amphenol's ruggedized SO-DIMM connectors meet AEC-Q100 reliability standards.