Memory Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
92791-051LF

92791-051LF

Storage & Server IO (Amphenol ICC)

CONN PCMCIA CARD PUSH-PULL

0

83818-20010

83818-20010

Storage & Server IO (Amphenol ICC)

C SH 5MM OE INS

0

83808-22111LF

83808-22111LF

Storage & Server IO (Amphenol ICC)

C SH TII 2 I/O REC INS C-2P3S SA

0

83808-21001LF

83808-21001LF

Storage & Server IO (Amphenol ICC)

C SH TII 1 I/O CARDBUS

0

83808-21010S

83808-21010S

Storage & Server IO (Amphenol ICC)

C SH TII 1 I/O INS

0

62195-003

62195-003

Storage & Server IO (Amphenol ICC)

CF CARD KIT UPPE

0

83808-22000LF

83808-22000LF

Storage & Server IO (Amphenol ICC)

PCMCIA T2 V2 ROCARD SHIELD

0

10017657-20210

10017657-20210

Storage & Server IO (Amphenol ICC)

SHIELD PLUS FRAME PLUS INSULATOR

0

92791-001

92791-001

Storage & Server IO (Amphenol ICC)

PCMCIA MECHANISM

0

10017657-20130-G1

10017657-20130-G1

Storage & Server IO (Amphenol ICC)

GEMTEK 23-600-0027

0

83808-21110LF

83808-21110LF

Storage & Server IO (Amphenol ICC)

C SH TII 1 I/O REC INS-2-P3S

0

83818-20110

83818-20110

Storage & Server IO (Amphenol ICC)

CARD SHLD 5MM OE LR INS

0

78242-001

78242-001

Storage & Server IO (Amphenol ICC)

LATCH FOR FLYING

0

83808-22010S

83808-22010S

Storage & Server IO (Amphenol ICC)

C SH TII 2 I/O INS

0

83808-20100LF

83808-20100LF

Storage & Server IO (Amphenol ICC)

C SH TII CLOSED-2P3S SAFT

0

92791-043LF

92791-043LF

Storage & Server IO (Amphenol ICC)

CONN PCMCIA CARD PUSH-PULL

0

83808-21000

83808-21000

Storage & Server IO (Amphenol ICC)

C SH TII 1 I/O

0

83818-20100LF

83818-20100LF

Storage & Server IO (Amphenol ICC)

CARD SHLD 5MM OE LR-2P3S SAFT

0

83818-20001LF

83818-20001LF

Storage & Server IO (Amphenol ICC)

C SH 5MM OE CB

0

57924-004

57924-004

Storage & Server IO (Amphenol ICC)

SHIELD PLUS FRAME PLUS INSULATOR

0

Memory Connectors - Accessories

1. Overview

Memory connectors and accessories are critical components that enable electrical and mechanical connections between memory modules (e.g., RAM, SSDs) and host systems. They ensure reliable signal transmission, power delivery, and mechanical stability in electronic devices. With advancements in computing performance and miniaturization trends, these components have become essential in applications ranging from consumer electronics to industrial systems.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
DIMM Connectors64-bit data path, ZIF (Zero Insertion Force) designDesktop PCs, Servers
SO-DIMM ConnectorsSmaller form factor, 200/260-pin configurationsLaptops, Embedded Systems
U-DIMM ConnectorsUnbuffered memory support, low-latency performanceGaming PCs, Workstations
SIMM Connectors32-bit data path, legacy technologyOlder Servers, Industrial Equipment
RIMM ConnectorsRDRAM-compatible, high-speed signalingLegacy High-Performance Computing

3. Structure & Components

Typical memory connectors consist of:

  • Contact pins (phosphor bronze with gold plating for conductivity)
  • Insulating housing (LCP/LPA material for thermal stability)
  • Actuator mechanism (for ZIF connectors)
  • EMI shielding (for high-frequency applications)
  • Retention clips (mechanical stabilization)

4. Key Technical Specifications

ParameterValue/RangeImportance
Contact Resistance5-20 m Affects signal integrity
Current Rating1-3 A/pinDetermines power capacity
Dielectric Withstanding Voltage500 VACSafety and reliability
Operating Temperature-55 C to +125 CEnvironmental durability
Insertion Force20-50NAffects lifespan
Signal IntegritySupports up to 8 GT/sEnables high-speed memory

5. Application Fields

  • Computer Hardware: Motherboards, Graphics Cards
  • Data Centers: Servers, Storage Arrays
  • Consumer Electronics: Smartphones, Tablets
  • Industrial Equipment: Automation Controllers
  • Telecommunications: Routers, Base Stations

6. Leading Manufacturers & Products

ManufacturerRepresentative Products
TE ConnectivityDDR4 DIMM Connectors, SATA Power Connectors
Amphenol ICCHigh-Speed SO-DIMM Sockets
MolexDDR5 U-DIMM Connectors
SamtecHigh-Frequency Memory Arrays
JAE ElectronicsCompact R-DIMM Solutions

7. Selection Guidelines

Key factors to consider:

  • Compatibility with memory standard (DDR3/DDR4/DDR5)
  • Environmental requirements (temperature, vibration)
  • Electrical performance requirements
  • Space constraints (form factor limitations)
  • Cost vs. reliability trade-offs
  • Compliance with industry standards (JEDEC, IPC)

8. Industry Trends Analysis

Current development trends include:

  • Transition to DDR5/LPDDR5X standards with 8 GT/s+ data rates
  • Miniaturization for mobile and IoT applications
  • Integrated power delivery (Power & Signal in single connector)
  • Advanced thermal management solutions
  • Increased use of press-fit terminations
  • Development of optical memory interconnects

Application Case: In high-density servers, TE Connectivity's DDR4 connectors enable 3200 MT/s memory speeds while maintaining signal integrity below 12 m resistance. For automotive applications, Amphenol's ruggedized SO-DIMM connectors meet AEC-Q100 reliability standards.

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