Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX102336

AX102336

Belden

MEDIAFLEX SVGA COUPLER INSERT

0

A0371912

A0371912

Belden

BIX DVO OUTLET, SURFACE,

0

AX105343-AL

AX105343-AL

Belden

KCONN USB2 A-A F/F COUPER, AL

0

AX101328

AX101328

Belden

CAT6+ JACK KCONN BROWN TIA606

195

AX101935

AX101935

Belden

MEDIAFLEX SC SM DUPLEX 3

0

AX100654

AX100654

Belden

EZ-MDVO UTP MODULE, CAT5E,

0

AX102037

AX102037

Belden

DECORA INSERT 1P VERT BL

0

AX101035

AX101035

Belden

FLEX MODULE, USOC, ELEC.WHITE

8

AX102272

AX102272

Belden

10GX JACK MDVO BLACK

600

AX105158-AL

AX105158-AL

Belden

MEDIAFLEX SVGA-STEREO INSERT

0

HIPULAM

HIPULAM

Belden

HIP UNIV INSERT MOD

0

AX104939

AX104939

Belden

KCONN LC DUP MM AQUA MOD BLK

200

AX101045

AX101045

Belden

CAT5E JACK MDVO ALMOND

0

AX104184-B24

AX104184-B24

Belden

CAT5E JACK KCONN YELLOW

0

AX101324

AX101324

Belden

CAT6+ JACK KCONN YELLOW TIA606

0

AX101317

AX101317

Belden

CAT5E JACK KCONN BROWN TIA606

0

AX104189-B24

AX104189-B24

Belden

CAT6+ JACK KCONN ORANGE

0

AX102596

AX102596

Belden

MDVO SC FIBER MODULE,

0

AX105354-AL

AX105354-AL

Belden

KCONN SIDE ENTRY BOX 4P ALM

0

AX102617

AX102617

Belden

MEDIAFLEX SVHS IDC INSER

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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