Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX105342-BK

AX105342-BK

Belden

KCONN USB3 A-A F/F COUPER, BK

0

AX100646

AX100646

Belden

EZ-MDVO UTP MODULE, CAT5E,

0

AX101824

AX101824

Belden

RCA MDVO INSERT ALMOND,

0

AX102618

AX102618

Belden

MEDIAFLEX SVGA IDC INSER

0

AX102101

AX102101

Belden

MDVO LC KEY DUP MM RD-WH

0

AX105343-EW

AX105343-EW

Belden

KCONN USB2 A-A F/F COUPER, EW

0

AX103031

AX103031

Belden

MDVO LC KEY DUP MM BR-BK

0

AX103157

AX103157

Belden

KEYSTONE LC KEYED MODULE

0

AX104152

AX104152

Belden

10GX JACK KCONN ORANGE (DARK)

0

AX102603

AX102603

Belden

RCA MDVO INSERT IVORY, R

0

AX102290

AX102290

Belden

10GX JACK KCONN BROWN TIA606

0

AX101327

AX101327

Belden

CAT6+ JACK KCONN PURPLE TIA606

0

AX101322

AX101322

Belden

CAT6+ JACK KCONN ORANGE TIA606

0

AX101827

AX101827

Belden

RCA MDVO INSERT GRAY YE

0

AX102285

AX102285

Belden

10GX JACK KCONN RED TIA606

0

AX103019

AX103019

Belden

MDVO LC KEY DUP MM BR-AL

0

AX102210

AX102210

Belden

MDVO LC DUP MM MOD ALMOND

0

AX102620

AX102620

Belden

MEDIAFLEX SC MM DUPLEX 3

0

AX101768

AX101768

Belden

MEDIAFLEX UTP INSERT 2-P

0

AX104194

AX104194

Belden

CAT6+ JACK KCONN PURPLE (DARK)

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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