Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX104191-B24

AX104191-B24

Belden

CAT6+ JACK KCONN YELLOW

0

AX102111

AX102111

Belden

MDVO LC KEY DUP MM OR-BK

0

AX104192-B24

AX104192-B24

Belden

CAT6+ JACK KCONN GREEN

0

AX100171

AX100171

Belden

EZ-MDVO UTP MODULE,

0

AX101884

AX101884

Belden

MEDIAFLEX SVHS IDC INSER

0

AX101310-B24

AX101310-B24

Belden

CAT5E JACK KCONN BLACK

0

AX101063

AX101063

Belden

CAT6+ JACK MDVO GRAY

50

AX101880

AX101880

Belden

MEDIAFLEX RCA IDC INSERT

0

AX105338-EW

AX105338-EW

Belden

KCONN RCA-WH COUPLER, E-WH

0

AX101936

AX101936

Belden

MEDIAFLEX SC DX SM INSERT ALM

0

AX104154

AX104154

Belden

10GX JACK KCONN YELLOW (DARK)

478

AX102419

AX102419

Belden

KCONN LC DUP SM MODULE, ALM

0

AX102091

AX102091

Belden

MDVO LC KEY DUP MM YL-GY

0

AX102036

AX102036

Belden

DECORA INSERT 1P VERT WH

0

A0644670

A0644670

Belden

BIX DVO OUTLET, FLUSH,

0

AX101771

AX101771

Belden

MEDIAFLEX UTP INSERT 2-P

0

AX102213

AX102213

Belden

MDVO LC DUP SM MOD GRAY

0

AX102275

AX102275

Belden

10GX JACK MDVO YELLOW TIA606

1088

AX102269

AX102269

Belden

10GX JACK MDVO GRAY

0

A0407001

A0407001

Belden

MDVO VIDEO F COAXIAL

1500

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

RFQ BOM Call Skype Email
Top