Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX104156

AX104156

Belden

10GX JACK KCONN BLUE (DARK)

3402

AX103020

AX103020

Belden

MDVO LC KEY DUP MM SL-AL

0

AX102905

AX102905

Belden

KCONN F-COAX MODULE BLK

3620

AX101318-B24

AX101318-B24

Belden

CAT6+ JACK KCONN GRAY

0

AX102684

AX102684

Belden

KCONN SC SIMP MM MODULE, E-WH

0

AX103159

AX103159

Belden

KEYSTONE LC KEYED MODULE

0

AX102627

AX102627

Belden

3.5MM STEREO INSERT MDVO

0

AX102907

AX102907

Belden

KCONN F-COAX MODULE E-WH

1840

AX102287

AX102287

Belden

10GX JACK KCONN GREEN TIA606

880

AX101040

AX101040

Belden

FLEX MODULE, USOC, GREEN

0

AX102211

AX102211

Belden

MDVO LC DUP MM MOD WHITE

40

AX102422

AX102422

Belden

KEYSTONE LC KEYED MODULE

0

AX101767

AX101767

Belden

MEDIAFLEX UTP INSERT 2-P

0

AX102244

AX102244

Belden

KCONN ST MODULE MM/SM BLK

110

AX102565

AX102565

Belden

FLEX MODULE USOC IVORY

0

AC303324

AC303324

Belden

MDVO SC SM W/GREEN SHUTTER

0

AX103025

AX103025

Belden

MDVO LC KEY DUP MM BR-WH

0

HIP-3H

HIP-3H

Belden

SPLITTER 3 WAY

0

AX104182

AX104182

Belden

CAT5E JACK KCONN ORANGE (DARK)

0

AX102090

AX102090

Belden

MDVO LC KEY DUP MM GN-GY

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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