| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Storage & Server IO (Amphenol ICC) |
CONTACT FLAT FLEX PIN GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX PIN GOLD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONTACT FLAT FLEX SOCKET GOLD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
DUFLEX CONTACT |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX PIN TIN-LEAD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET TIN-LD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET GOLD |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONTACT FLAT FLEX SOCKET TIN |
0 |
|
|
Storage & Server IO (Amphenol ICC) |
CONTACT FLAT FLEX SOCKET GOLD |
1660 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SPLICE GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX PIN |
0 |
|
|
Hirose |
CONN CONTACT FOR FX16 SERIES |
0 |
|
|
Woodhead - Molex |
CONTACT FLAT FLEX SOCKET GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX PIN GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET TIN |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX SOCKET GOLD |
0 |
|
|
TE Connectivity AMP Connectors |
CONTACT FLAT FLEX PIN GOLD |
0 |
|
Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) connectors are specialized electrical components designed to interconnect flexible circuits in compact electronic systems. These connectors enable high-density, space-saving connections while maintaining signal integrity in dynamic or confined environments. Their importance has grown exponentially with the miniaturization of consumer electronics, automotive systems, and industrial equipment.
| Type | Functional Features | Application Examples |
| ZIF (Zero Insertion Force) | Uses mechanical actuation for contact pressure without insertion force | Smartphones, LCD panels |
| Non-ZIF Clamp Type | Requires manual compression for connection | Industrial control panels |
| Self-Aligning FPC | Features alignment guides for automated assembly | Automotive sensors |
| High-Speed Differential Pair | Optimized for >5 Gbps signal transmission | 5G base stations |
Typical FFC/FPC connectors consist of: - Contact Terminals: Phosphor bronze or beryllium copper with gold-plated contact surfaces - Insulation Housing: High-temperature resistant LCP or nylon materials - Actuation Mechanism: Flip lock or slide lock systems for ZIF variants - Shielding Layer: Optional EMI protection through stainless steel covers The contacts are designed with cross-beam or leaf-spring structures to maintain consistent normal force over 10,000+ mating cycles.
| Parameter | Typical Value | Importance |
| Contact Resistance | 10-30 m | Determines power loss and heating |
| Insulation Resistance | >100 M | Prevents leakage currents |
| Operating Temperature | -40 C to +105 C | Environmental reliability |
| Mating Cycle Life | 5,000-20,000 cycles | Product longevity |
| Current Rating | 0.5-3A per contact | Power handling capability |
Major industries include: - Consumer Electronics: Foldable smartphones, wearables (e.g., Apple Watch display connections) - Automotive: ADAS camera modules, center console infotainment systems - Medical: Portable ultrasound devices, endoscopic cameras - Industrial: Robotics joint sensors, CNC machine control boards
| Manufacturer | Key Product Series | Unique Features |
| TE Connectivity | FFC ZIF Series 2058 | 0.5mm pitch, 10Gbps data rate |
| Molex | SLIMSTACK FPC | 0.4mm stack height reduction |
| JAE Electronics | DF11 Series | Dual-beam contact design |
| Amphenol | Smart Spring Contact | Self-cleaning contact surface |
Consider: - Space constraints (pitch size down to 0.2mm available) - Signal requirements (high-speed vs. power transmission) - Environmental conditions (temperature, vibration) - Mating cycle requirements (consumer: 5,000 cycles vs. industrial: 20,000+) - Cost vs. performance trade-offs (gold plating thickness options)
Key developments: - Miniaturization: 0.18mm pitch prototypes in development - High-speed evolution: 224 Gbps SerDes compatibility research - 3D printing integration for complex connector geometries - Increased adoption in EVs for battery management systems - Enhanced reliability under thermal cycling (-55 C to +150 C) for aerospace applications