FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
F519-1A7A1-11016-E200 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1329
HLW6R-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 6POS 1.00MM R/A	12754
SLW12R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 12POS 1.00MM R/A	2803
62674-161121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 16POS 0.50MM SMD	286
SLW18S-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 18POS 1MM PCB	798
66226-020LF Storage & Server IO (Amphenol ICC)	CONN FFC HEADER 20POS 2.54MM	270
HLW8R-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 8POS 1.00MM R/A	8894
SFW30S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 30POS 1MM SMD	141
65801-108LF Storage & Server IO (Amphenol ICC)	CONN CIC RCPT 8POS 2.54MM	5356
SFV4R-3STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 4POS 0.50MM R/A	5643
F52Q-1A7H1-11007 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1650
65801-028LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 28POS 2.54MM	0
SFW8R-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 8POS 1.00MM R/A	3068
65801-014LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC RCPT 14POS 2.54MM	133
F305-1A7H1-21022-E100 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1973
SFW22R-3STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 22POS 1.00MM R/A	0
SFW4S-2STME1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 4POS 1MM SMD	915
SFW8R-3STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 8POS 1.00MM R/A	2720
HLW8S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 8POS 1MM PCB	2192
HLW4R-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 4POS 1.00MM R/A	12739

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities