FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
59453-081110EDHLF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 8POS 0.50MM R/A	5613
F516-1A7H1-21014 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1985
SFW20R-4STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 20POS 1MM R/A	1871
F300-1B7H1-11030-E100 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1874
62674-241121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 24POS 0.50MM SMD	0
SLW15R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 15POS 1.00MM R/A	0
SFV4R-1STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 4POS 0.50MM R/A	1458
62674-211121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 21POS 0.50MM SMD	1000
F31G-1A7H1-11012 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1067
HLW15S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 15POS 1MM PCB	499
SLW26R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 26POS 1.00MM R/A	2235
10051922-1410ELF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 14POS 0.50MM R/A	966
F52Q-1A7H1-11009 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1650
10051922-1510ELF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 15POS 0.50MM R/A	20126
F52R-1A7H1-11006 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1678
HFW7S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 7POS 1MM SMD	196
10051922-2810ELF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 28POS 0.50MM R/A	4490
SFV22R-2STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 22POS 0.50MM R/A	7126
SFV18R-2STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 18POS 0.50MM R/A	1260
SFW18S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 18POS 1MM SMD	5294

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities