FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
SFW15S-2STMAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC VERT 15POS 1.00MM SMD	0
SLW15R-5C7LF Storage & Server IO (Amphenol ICC)	CONN CIC BOTTOM 15POS 1.00MM R/A	0
SFV4R-4STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 4POS 0.50MM R/A	4224
HFW7R-2STAE1H1LF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 7POS 1MM R/A	0
62674-201121DLF Storage & Server IO (Amphenol ICC)	CONN FFC VERT	0
HFW32S-4STZE1HLF Storage & Server IO (Amphenol ICC)	FFC/FPC FLEX CONN	0
SFW30R-3STAE9LF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 30POS 1.00MM R/A	0
SFW25R-3STAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 25POS 1MM R/A	0
SFW4R-4STE5LF Storage & Server IO (Amphenol ICC)	FFC/FPC CONN	0
F300-1B7H1-11026-E100 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	2000
SFW18S-2STMAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC VERT 18POS 1MM SMD	0
SFW4R-1STE9LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 4POS 1.00MM R/A	1068
SFW10S-2STAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC VERT 10POS 1.00MM SMD	2000
SFW30S-2STE9LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 30POS 1MM SMD	0
SFW6R-5STZE1LF Storage & Server IO (Amphenol ICC)	CONN CIC BOTTOM 6POS 1MM R/A	4000
59453-051110ECHLF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 5POS 0.50MM R/A	9336
SFV32R-1STAE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 32POS 0.50MM R/A	0
SFW27R-2STE9LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 27POS 1MM R/A	0
SFV13R-1STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 13POS 0.50MM R/A	0
SFV5R-2STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 5POS 0.50MM R/A	5995

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities