FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
HLW6R-2A7HLF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 6POS 1MM R/A	0
SFW28R-3STAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 28POS 1.00MM R/A	0
F32D-1A7Y1-21060 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1600
SFW8R-1STGE1LF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 8POS 1MM R/A	0
HFW29R-1STE1H1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 29POS 1.00MM R/A	0
SFW6R-5STE1LF Storage & Server IO (Amphenol ICC)	CONN CIC BOTTOM 6POS 1.00MM R/A	0
F31S-1A7L1-11050 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	872
SFV22R-1STBE9HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 22POS 0.50MM R/A	0
SFV31R-4STE1HLF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 31POS 0.50MM R/A	6000
SLW12R-5C7LF Storage & Server IO (Amphenol ICC)	CONN CIC BOTTOM 12POS 1.00MM R/A	0
10064555-152220HLF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 15POS 0.30MM R/A	0
F31L-1A7H1-11006 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1698
SFV31R-4STBE1HLF Storage & Server IO (Amphenol ICC)	CONN FPC TOP 31POS 0.50MM R/A	0
SFW5S-2STMAE1LF Storage & Server IO (Amphenol ICC)	CONN FPC VERT 5POS 1MM SMD	2000
10061122-151120HLF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 15POS 0.30MM R/A	4992
F31L-1A7H1-11055 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1692
HFW13S-2STAE1HLF Storage & Server IO (Amphenol ICC)	FFC/FPC FLEX CONN	0
SFV33R-2STE9HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 33POS 0.50MM R/A	400
F31W-1A7H1-11020 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1199
SFW6R-6STE1LF Storage & Server IO (Amphenol ICC)	CONN CIC TOP 6POS 1.00MM R/A	1621

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities