FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
68712014022 Würth Elektronik Midcom	CONN FPC TOP 20POS 0.50MM R/A	1966
687124183722 Würth Elektronik Midcom	CONN FFC BTM 24POS 0.5MM SMD R/A	862
686126188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2995
686108188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2942
68711614522 Würth Elektronik Midcom	CONN FPC BOTTOM 16POS 0.50MM R/A	4000
68611014122 Würth Elektronik Midcom	CONN FPC TOP 10POS 1.00MM R/A	37
686108183522 Würth Elektronik Midcom	CONN FFC BTM 8POS 1MM SMD R/A	3412
687122149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 22POS	1698
687114183722 Würth Elektronik Midcom	CONN FFC BTM 14POS 0.5MM SMD R/A	0
687114182122 Würth Elektronik Midcom	CONN FFC FPC 14POS 0.5MM R/A	0
68713014022 Würth Elektronik Midcom	CONN FPC TOP 30POS 0.50MM R/A	1908
686130148922 Würth Elektronik Midcom	CONN 1MM HORZ BOTTOM SMD 30POS	676
686118188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2998
686106188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2974
687108149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 8POS	1342
68611414122 Würth Elektronik Midcom	CONN FPC TOP 14POS 1.00MM R/A	134
68711014022 Würth Elektronik Midcom	CONN FPC TOP 10POS 0.50MM R/A	1335
686112188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2999
687128149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 28POS	1845
686124188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2987

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities