FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
687106183622 Würth Elektronik Midcom	CONN FFC TOP 6POS 0.5MM SMD R/A	862
687112183622 Würth Elektronik Midcom	CONN FFC TOP 12POS 0.5MM SMD R/A	1793
686104183522 Würth Elektronik Midcom	CONN FFC BTM 4POS 1MM SMD R/A	5193
687330124422 Würth Elektronik Midcom	CONN FPC VERT 30POS 0.50MM SMD	118
687118182122 Würth Elektronik Midcom	CONN FFC FPC 18POS 0.5MM R/A	0
68714014022 Würth Elektronik Midcom	CONN FPC TOP 40POS 0.50MM R/A	5168
686118183522 Würth Elektronik Midcom	CONN FFC BTM 18POS 1MM SMD R/A	0
68610614422 Würth Elektronik Midcom	CONN FPC BOTTOM 6POS 1.00MM R/A	1483
686124148922 Würth Elektronik Midcom	CONN 1MM HORZ BOTTOM SMD 24POS	497
68711214522 Würth Elektronik Midcom	CONN FPC BOTTOM 12POS 0.50MM R/A	2319
687120149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 20POS	637
687126183622 Würth Elektronik Midcom	CONN FFC TOP 26POS 0.5MM SMD R/A	190
686128188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2996
68712014522 Würth Elektronik Midcom	CONN FPC BOTTOM 20POS 0.50MM R/A	1776
686104148922 Würth Elektronik Midcom	CONN 1MM HORZ BOTTOM SMD 4POS	849
68612014422 Würth Elektronik Midcom	CONN FPC BOTTOM 20POS 1.00MM R/A	1398
686114183522 Würth Elektronik Midcom	CONN FFC BTM 14POS 1MM SMD R/A	1040
686108148922 Würth Elektronik Midcom	CONN 1MM HORZ BOTTOM SMD 8POS	3653
687112149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 12POS	1357
686108183422 Würth Elektronik Midcom	CONN FFC TOP 8POS 1MM SMD R/A	1626

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities