FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
046806070000846+ KYOCERA Corporation	0.5MM PITCH - 70 POS - RIGHT ANG	2910
046806040000846+ KYOCERA Corporation	0.5MM PITCH - 40 POS - RIGHT ANG	2700
046809616210846+ KYOCERA Corporation	0.5MM PITCH - 16 POS - RT ANGLE	3966
046844761002846+ KYOCERA Corporation	0.3MM PITCH - 61 POS - RT ANGLE	4918
046251040010846+ KYOCERA Corporation	0.5MM PITCH - 40 POS - VERTICAL	13
046214015010846+ KYOCERA Corporation	0.5MM PITCH - 15 POS - VERTICAL	4950
046810650001846+ KYOCERA Corporation	0.5MM PITCH - 50 POS - RT ANGLE	0
046232114015800 KYOCERA Corporation	CONN FFC FPC VERT 14POS 1MM SMD	0
006200514230000 KYOCERA Corporation	CONN FFC BOTTOM 14POS 1.00MM R/A	0
046810620000846+ KYOCERA Corporation	0.5MM PITCH - 20 POS - VERTICAL	1025
046251050010846+ KYOCERA Corporation	0.5MM PITCH - 50 POS - VERTICAL	1874
046293631005829+ KYOCERA Corporation	0.3MM PITCH - 31 POS - RT ANGLE	1990
046844727002846+ KYOCERA Corporation	0.3MM PITCH - 27 POS - RT ANGLE	4996
046232112015800+ KYOCERA Corporation	CONN FFC FPC VERT 12POS 1MM SMD	0
046244416010846+ KYOCERA Corporation	0.5MM PITCH - 16 POS - VERTICAL	5276
046227006100829+ KYOCERA Corporation	1.0MM PITCH - 6 POS - RT ANGLE -	1692
046232103015800 KYOCERA Corporation	CONN FFC FPC VERT 3POS 1MM SMD	0
046806080000846+ KYOCERA Corporation	0.5MM PITCH - 80 POS - RIGHT ANG	2183
046809611110846+ KYOCERA Corporation	0.5MM PITCH - 11 POS - RT ANGLE	1139
046806010000846+ KYOCERA Corporation	0.5MM PITCH - 10 POS - RIGHT ANG	2093

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities