FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
046284012002846+ KYOCERA Corporation	0.5MM PITCH - 12 POS - RT ANGLE	2965
046866735000846+ KYOCERA Corporation	0.2MM PITCH - 35 POS - RT ANGLE	4937
046810620001846+ KYOCERA Corporation	0.5MM PITCH - 20 POS - RT ANGLE	1454
046244424010846+ KYOCERA Corporation	0.5MM PITCH - 24 POS - VERTICAL	4486
046288016000846+ KYOCERA Corporation	CONN FFC BOTTOM 16POS 0.50MM R/A	0
046808607000846+ KYOCERA Corporation	BATTERY FPC CONNECTOR	758
046844741002846+ KYOCERA Corporation	0.3MM PITCH - 41 POS - RT ANGLE	4928
046288020000846+ KYOCERA Corporation	CONN FFC BOTTOM 20POS 0.50MM R/A	2792
046293651005829+ KYOCERA Corporation	0.3MM PITCH - 51 POS - RT ANGLE	1986
046232108103800 KYOCERA Corporation	CONN FFC FPC TOP 8POS 1.00MM R/A	0
046214011010846+ KYOCERA Corporation	0.5MM PITCH - 11 POS - VERTICAL	2776
046232114015800+ KYOCERA Corporation	CONN FFC FPC VERT 14POS 1MM SMD	0
046244426010846+ KYOCERA Corporation	0.5MM PITCH - 26 POS - VERTICAL	4414
046214012010846+ KYOCERA Corporation	0.5MM PITCH - 12 POS - VERTICAL	2262
046844715002846+ KYOCERA Corporation	0.3MM PITCH - 15 POS - RT ANGLE	4974
046809612110846+ KYOCERA Corporation	0.5MM PITCH - 12 POS - RT ANGLE	571
046809610110846+ KYOCERA Corporation	0.5MM PITCH - 10 POS - RT ANGLE	1422
046293643005829+ KYOCERA Corporation	0.3MM PITCH - 43 POS - RT ANGLE	1884
046232112103800+ KYOCERA Corporation	CONN FFC FPC TOP 12POS 1MM R/A	0
046810630001846+ KYOCERA Corporation	0.5MM PITCH - 30 POS - RT ANGLE	1352

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities