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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
FA1004SA1-R8000

FA1004SA1-R8000

JAE Electronics

CONN FPC 4POS 0.50MM R/A

4857
FA5S045HP1

FA5S045HP1

JAE Electronics

CONN FPC BOTTOM 45POS 0.50MM R/A

0
FA5S030HP1

FA5S030HP1

JAE Electronics

CONN FPC BOTTOM 30POS 0.50MM R/A

0
FF0360SA1

FF0360SA1

JAE Electronics

CONN FPC BOTTOM 60POS 0.50MM R/A

75
FA5S016HP1

FA5S016HP1

JAE Electronics

CONN FPC BOTTOM 16POS 0.50MM R/A

0
FA5S040HP1

FA5S040HP1

JAE Electronics

CONN FPC BOTTOM 40POS 0.50MM R/A

511
FA5S022HP1

FA5S022HP1

JAE Electronics

CONN FPC BOTTOM 22POS 0.50MM R/A

0
FA5B030HP1

FA5B030HP1

JAE Electronics

CONN FPC BOTTOM 30POS 0.50MM SMD

0
FB10S045JA2R6000

FB10S045JA2R6000

JAE Electronics

CONN FPC BOTTOM 45POS 0.30MM R/A

1490
FA5S050HP1

FA5S050HP1

JAE Electronics

CONN FPC BOTTOM 50POS 0.50MM R/A

250
FA5S010HP1

FA5S010HP1

JAE Electronics

CONN FPC BOTTOM 10POS 0.50MM R/A

0
FF02S55SV1

FF02S55SV1

JAE Electronics

CONN FPC BOTTOM 55POS 0.30MM R/A

0
FA5S020HP1

FA5S020HP1

JAE Electronics

CONN FPC BOTTOM 20POS 0.50MM R/A

0
FF0364SA1

FF0364SA1

JAE Electronics

CONN FPC BOTTOM 64POS 0.50MM R/A

0
FA5B050HP1

FA5B050HP1

JAE Electronics

CONN FPC BOTTOM 50POS 0.50MM SMD

0
FA1010SA1-R8000

FA1010SA1-R8000

JAE Electronics

10 PIN, 0.5MM PITCH, 0.9MM HEIGH

5404
FA5B010HP1

FA5B010HP1

JAE Electronics

CONN FPC BOTTOM 10POS 0.50MM SMD

0
FA1005SA1-R8000

FA1005SA1-R8000

JAE Electronics

CONN FPC 5POS 0.50MM R/A

330
FA5B040HP1

FA5B040HP1

JAE Electronics

CONN FPC BOTTOM 40POS 0.50MM SMD

51
FA5B008HP1

FA5B008HP1

JAE Electronics

CONN FPC BOTTOM 8POS 0.50MM SMD

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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