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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
FA5B016HP1

FA5B016HP1

JAE Electronics

CONN FPC BOTTOM 16POS 0.50MM SMD

0
FB10S031JT1R6000

FB10S031JT1R6000

JAE Electronics

CONN FPC BTM 31POS 0.3MM SMD R/A

0
FA5S015HP1R3000

FA5S015HP1R3000

JAE Electronics

CONN FPC BOTTOM 15POS 0.50MM R/A

0
FF0396SA1-R2000

FF0396SA1-R2000

JAE Electronics

CONN FPC BOTTOM 96POS 0.50MM R/A

0
FB10S061JT1R6000

FB10S061JT1R6000

JAE Electronics

CONN FPC BTM 61POS 0.3MM SMD R/A

3028
FA5S010HP1R3000

FA5S010HP1R3000

JAE Electronics

CONN FPC BOTTOM 10POS 0.50MM R/A

0
FF0829SA1-R3000

FF0829SA1-R3000

JAE Electronics

CONN FPC BOTTOM 29POS 0.20MM R/A

0
FF02S40SV1

FF02S40SV1

JAE Electronics

CONN FPC BOTTOM 40POS 0.30MM R/A

0
FF0215SS1-C100

FF0215SS1-C100

JAE Electronics

CONN FPC BOTTOM 15POS 0.30MM R/A

0
FB3S061C11

FB3S061C11

JAE Electronics

CONN FPC BOTTOM 61POS 0.30MM R/A

0
IL-FPR-5S-HF-N1

IL-FPR-5S-HF-N1

JAE Electronics

CONN FPC BOTTOM 5POS 0.50MM R/A

0
IL-FPR-16S-VF-N1

IL-FPR-16S-VF-N1

JAE Electronics

CONN FPC VERT 16POS 0.50MM SMD

0
FF0364SA1-R2000

FF0364SA1-R2000

JAE Electronics

CONN FPC BOTTOM 64POS 0.50MM R/A

0
FB10S033JA2R6000

FB10S033JA2R6000

JAE Electronics

CONN FPC BOTTOM 33POS 0.30MM R/A

0
FF0841SA1-R300

FF0841SA1-R300

JAE Electronics

CONN FPC BOTTOM 41POS 0.20MM R/A

0
FB6S057JA1

FB6S057JA1

JAE Electronics

CONN FPC BOTTOM 57POS 0.30MM R/A

0
FB6S029JA1

FB6S029JA1

JAE Electronics

CONN FPC BOTTOM 29POS 0.30MM R/A

0
FB8S031JA1

FB8S031JA1

JAE Electronics

CONN FPC TOP 31POS 0.30MM R/A

0
FB6S033JA1

FB6S033JA1

JAE Electronics

CONN FPC BOTTOM 33POS 0.30MM R/A

0
FB8S033JA1

FB8S033JA1

JAE Electronics

CONN FPC TOP 33POS 0.30MM R/A

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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