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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0015474076

0015474076

Woodhead - Molex

CONN CIC FFC RCPT 7POS 2.54MM

0
0781190810

0781190810

Woodhead - Molex

0.5 FPC CONN. NON-ZIF ST EMBSTP

0
0781193410

0781193410

Woodhead - Molex

0.5 FPC CONN. ZIF ST EMB TP PKG

0
2005280150

2005280150

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 15

0
5052780433

5052780433

Woodhead - Molex

0.5 FFC ZIF BTM CONT EMBT PKG 4C

0
0015475070

0015475070

Woodhead - Molex

CONN FFC PLUG 7POS 2.54MM

0
0781192610

0781192610

Woodhead - Molex

0.5 FPC CONN. ZIF ST EMB TP PKG

0
0520452545

0520452545

Woodhead - Molex

CONN FFC VERT 25POS 1.25MM PCB

0
0527932370

0527932370

Woodhead - Molex

CONN FPC TOP 23POS 1.00MM R/A

0
5051108096

5051108096

Woodhead - Molex

CONN FFC/FPC 80POS .5MM SMD R/A

0
0512966033

0512966033

Woodhead - Molex

CONN FFC BOTTOM 60POS 0.50MM R/A

0
0039532175

0039532175

Woodhead - Molex

CONN FFC VERT 17POS 1.25MM PCB

3734
2005290170

2005290170

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 17

0
0022153123

0022153123

Woodhead - Molex

CONN FFC BOTTOM 12POS 2.54MM R/A

0
0015388117

0015388117

Woodhead - Molex

CONN CIC FFC RCPT 11POS 2.54MM

0
5051103891

5051103891

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 38

0
0527460933

0527460933

Woodhead - Molex

CONN FFC BOTTOM 9POS 0.50MM R/A

0
0015388200

0015388200

Woodhead - Molex

CONN CIC FFC RCPT 20POS 2.54MM

0
2004850550

2004850550

Woodhead - Molex

0.5 ONE-TOUCH ST 50P

0
0781271199

0781271199

Woodhead - Molex

CONN FFC VERT 19POS 0.50MM SMD

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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