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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0528081970

0528081970

Woodhead - Molex

1.0 FFC NONZIFSMTSTHSGASSY19CKTE

0
0015389162

0015389162

Woodhead - Molex

CONN CIC FFC PLUG 16POS 2.54MM

0
0781192420

0781192420

Woodhead - Molex

CONN 0.5 FPC ZIF ST AU TP 24CKT

0
0781191820

0781191820

Woodhead - Molex

CONN 0.5 FPC ZIF ST AU TP 18CKT

0
0526100934

0526100934

Woodhead - Molex

CONN FPC VERT 9POS 1.00MM SMD

0
0512965033

0512965033

Woodhead - Molex

CONN FFC BOTTOM 50POS 0.50MM R/A

0
0528932433

0528932433

Woodhead - Molex

05 FFCFPC ZIF E02HSGASSY24CKTEMB

0
5051106191

5051106191

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 61

0
0781273620

0781273620

Woodhead - Molex

CONN 0.5 FPC ZIF ST AU TP 36CKT

0
5051105391

5051105391

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 53

0
5025983393

5025983393

Woodhead - Molex

CONN FPC 33POS 0.30MM R/A

9161
0781192820

0781192820

Woodhead - Molex

0.5 FPC CONN. ZIF ST AU EMB TP P

0
5047543520

5047543520

Woodhead - Molex

CONN FPC 35POS .3MM SMD R/A

0
5051105596

5051105596

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 55

0
0015475140

0015475140

Woodhead - Molex

CONN FFC PLUG 14POS 2.54MM

0
0015388149

0015388149

Woodhead - Molex

CONN CIC FFC RCPT 14POS 2.54MM

0
5051102696

5051102696

Woodhead - Molex

CONN FFC/FPC 26POS .5MM SMD R/A

0
0528071910

0528071910

Woodhead - Molex

CONN FPC TOP 19POS 1.00MM R/A

0
0525592133

0525592133

Woodhead - Molex

CONN FFC VERT 21POS 0.50MM SMD

0
0015388157

0015388157

Woodhead - Molex

CONN CIC FFC RCPT 15POS 2.54MM

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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