FFC, FPC (Flat Flexible) Connectors

Image	Part Number	Description / PDF	Quantity	Rfq
	0015388057 Woodhead - Molex	CONN CIC FFC RCPT 5POS 2.54MM	0
	5051102796 Woodhead - Molex	0.5 FPC ZIF BTM CONT EMBT PKG 27	0
	0015474027 Woodhead - Molex	CONN CIC FFC RCPT 2POS 2.54MM	0
	2004850760 Woodhead - Molex	0.5 ONE-TOUCH ST 60P GND	0
	0015388258 Woodhead - Molex	CONN CIC FFC RCPT 25POS 2.54MM	0
	0781271179 Woodhead - Molex	CONN FFC VERT 17POS 0.50MM SMD	0
	0781193510 Woodhead - Molex	0.5 FPC CONN. ZIF ST EMB TP PKG	0
	0526100634 Woodhead - Molex	CONN FPC VERT 6POS 1.00MM SMD	0
	2005280220 Woodhead - Molex	1.0 FPC ZIF BTM CONT EMBT PKG 22	0
	0015474244 Woodhead - Molex	CONN CIC FFC RCPT 24POS 2.54MM	0
	0528070710 Woodhead - Molex	CONN FPC TOP 7POS 1.00MM R/A	0
	2004850460 Woodhead - Molex	0.5 ONE-TOUCH RA 60P	0
	5047540700 Woodhead - Molex	CONN FPC 7POS .3MM SMD R/A	0
	0524372371 Woodhead - Molex	CONN FFC BOTTOM 23POS 0.50MM R/A	0
	0781271389 Woodhead - Molex	CONN FFC VERT 38POS 0.50MM SMD	0
	0528921733 Woodhead - Molex	CONN FFC BOTTOM 17POS 0.50MM R/A	0
	0781271220 Woodhead - Molex	CONN 0.5 FPC ZIF ST AU TP 12CKT	0
	5019510450 Woodhead - Molex	0.5 FPC HSG ASSY EASYONST4CKTEMB	0
	0525591752 Woodhead - Molex	0.5 FPC ZIF SMT ST 17CKT EMBSTP	0
	5047403300 Woodhead - Molex	CONN FPC 33POS .3MM SMD R/A	0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities