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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0781192410

0781192410

Woodhead - Molex

CONN 0.5 FPC ZIF ST 24CKT

0
0781193110

0781193110

Woodhead - Molex

CONN 0.5 FPC ZIF ST TP 31CKT

0
5051104491

5051104491

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 44

0
5047540900

5047540900

Woodhead - Molex

CONN FPC 9POS .3MM SMD R/A

0
0039532134

0039532134

Woodhead - Molex

CONN FFC TOP 13POS 1.25MM R/A

2276
0015474061

0015474061

Woodhead - Molex

CONN CIC FFC RCPT 6POS 2.54MM

0
0781273420

0781273420

Woodhead - Molex

0.5 FPC CONN. ZIF ST AU EMB TP P

0
2004850140

2004850140

Woodhead - Molex

0.5 ONE-TOUCH ST 40P HT

0
0015474110

0015474110

Woodhead - Molex

CONN CIC FFC RCPT 11POS 2.54MM

0
0015474202

0015474202

Woodhead - Molex

CONN CIC FFC RCPT 20POS 2.54MM

0
5018645080

5018645080

Woodhead - Molex

CONN FFC BOTTOM 50POS 0.50MM R/A

0
0528082970

0528082970

Woodhead - Molex

CONN FPC VERT 29POS 1.00MM SMD

0
5019511350

5019511350

Woodhead - Molex

0.5 FPC HSG ASSY EASYONST13CKTEM

0
0015474060

0015474060

Woodhead - Molex

CONN CIC FFC RCPT 6POS 2.54MM

0
2005290040

2005290040

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 4C

52
0528521970

0528521970

Woodhead - Molex

CONN FFC BOTTOM 19POS 1.00MM R/A

4694
5019513850

5019513850

Woodhead - Molex

0.5 FPC HSG ASSY EASYONST38CKTEM

0
5051102191

5051102191

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 21

0
0781191520

0781191520

Woodhead - Molex

0.5 FPC CONN. ZIF ST AU EMB TP P

0
0520453545

0520453545

Woodhead - Molex

CONN FFC VERT 35POS 1.25MM PCB

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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