ample-chip ample-chip
RFQ
BOM

FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0015474091

0015474091

Woodhead - Molex

CONN CIC FFC RCPT 9POS 2.54MM

0
2005280260

2005280260

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 26

0
0520301529

0520301529

Woodhead - Molex

CONN FPC VERT 15POS 1.00MM PCB

0
5019510550

5019510550

Woodhead - Molex

0.5 FPC HSG ASSY EASYONST5CKTEMB

0
0781191920

0781191920

Woodhead - Molex

0.5 FPC CONN. ZIF ST AU EMB TP P

0
0015389142

0015389142

Woodhead - Molex

CONN CIC FFC PLUG 14POS 2.54MM

0
5051105896

5051105896

Woodhead - Molex

0.5 FPC ZIF BTM CONT EMBT PKG 58

0
5051104596

5051104596

Woodhead - Molex

CONN FFC/FPC 45POS .5MM SMD R/A

0
2004850340

2004850340

Woodhead - Molex

0.5 ONE-TOUCH ST 40P HT GND

0
0781192220

0781192220

Woodhead - Molex

0.5 FPC CONN. ZIF ST AU EMB TP P

0
0522072960

0522072960

Woodhead - Molex

1.0 FPC ZIFSMTHSGASSY29CKTEMBSTP

0
0522072933

0522072933

Woodhead - Molex

CONN FFC FPC TOP 29POS 1MM R/A

0
2004850351

2004850351

Woodhead - Molex

0.5 ONE-TOUCH ST 51P HT GND

0
0527930970

0527930970

Woodhead - Molex

CONN FPC TOP 9POS 1.00MM R/A

1326
0528521470

0528521470

Woodhead - Molex

CONN FFC BOTTOM 14POS 1.00MM R/A

0
0015475034

0015475034

Woodhead - Molex

CONN FFC PLUG 3POS 2.54MM

0
0015474250

0015474250

Woodhead - Molex

CONN CIC FFC RCPT 25POS 2.54MM

0
5019512450

5019512450

Woodhead - Molex

0.5 FPC HSG ASSY EASYONST24CKTEM

0
0528061910

0528061910

Woodhead - Molex

CONN FPC VERT 19POS 1.00MM PCB

0
5047542120

5047542120

Woodhead - Molex

CONN FPC 21POS .3MM SMD R/A

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
RFQ BOM Call Skype Email
Top