FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
PCA-6-LA-04-HL-3 Adam Tech	FPC/FFC CONNECTOR ZIF TYPE .5M	904
XF2L-0725-1A Omron Electronics Components	CONN FPC TOP 7POS 0.50MM R/A	2612
F31G-1A7H1-11012 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1067
FH28D-20S-0.5SH(98) Hirose	CONN FFC BOTTOM 20POS 0.50MM R/A	4423
0525590853 Woodhead - Molex	CONN FFC VERT 8POS 0.50MM SMD	0
AYF353925A Panasonic	CONN FPC TOP 39POS 0.3MM SMD R/A	396
686106188822 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT VERTICAL LIF	1371
XF2U-3015-3A Omron Electronics Components	CONN FPC 30POS 0.50MM R/A	880
0526101833 Woodhead - Molex	CONN FPC VERT 18POS 1.00MM SMD	1186
FH28-50S-0.5SH(05) Hirose	CONN FFC BOTTOM 50POS 0.50MM R/A	19686
AYF534065T Panasonic	CONN FPC 40POS 0.50MM R/A	4891
FH41-40S-0.5SH(05) Hirose	CONN FFC BOTTOM 40POS 0.50MM R/A	1571
HLW15S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 15POS 1MM PCB	499
0524372171 Woodhead - Molex	CONN FFC BOTTOM 21POS 0.50MM R/A	124
FA5S040HP1 JAE Electronics	CONN FPC BOTTOM 40POS 0.50MM R/A	511
ZF5S-50-01-T-WT Samtec, Inc.	ZERO INSERTION FORCE .5MM ASSY	83
5027908091 Woodhead - Molex	CONN FPC BOTTOM 80POS 0.50MM R/A	4000
2004850520 Woodhead - Molex	0.5 ONE-TOUCH ST 20P	6000
XF2M-3815-1A-R100 Omron Electronics Components	CONN FPC 38POS 0.50MM R/A	0
1-1734839-4 TE Connectivity AMP Connectors	CONN FPC TOP 14POS 0.50MM R/A	28932

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities