FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
84984-6 TE Connectivity AMP Connectors	CONN FFC FPC VERT 6POS 1MM PCB	8501
AYF530865T Panasonic	CONN FPC 8POS 0.50MM R/A	0
0541324562 Woodhead - Molex	CONN FFC BOTTOM 45POS 0.50MM R/A	39739000
0015474033 Woodhead - Molex	CONN FFC CIC RCPT 3POS 2.54MM	2428
1-1775333-3 TE Connectivity AMP Connectors	CONN FPC BOTTOM 13POS 0.50MM R/A	0
XF2L-0735-1A Omron Electronics Components	CONN FPC BOTTOM 7POS 0.50MM R/A	1453
046841023100846+ KYOCERA Corporation	0.3MM PITCH - 15 POS - VERTICAL	1927
FH12-11S-1SH(1)(98) Hirose	CONN FFC BOTTOM 11POS 1.00MM R/A	0
30FMN-BMT-A-TF(LF)(SN) JST	CONN FFC VERT 30POS 1.00MM SMD	5015
1-1775333-7 TE Connectivity AMP Connectors	CONN FPC BOTTOM 17POS 0.50MM R/A	0
XF3M-2215-1B-R100 Omron Electronics Components	CONN FFC FPC 22POS 0.50MM R/A	200
5051106491 Woodhead - Molex	CONN FFC/FPC BOTTOM 64P .5MM R/A	5930
FH29BW-24S-0.2SHW(99) Hirose	CONN FPC BOTTOM 24POS 0.20MM R/A	0
SFV4R-1STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 4POS 0.50MM R/A	1458
ZF1-10-02-T-WT-TR Samtec, Inc.	ZERO INSERTION FORCE 1MM ASSEMBL	333
AYF332335A Panasonic	CONN FPC 23POS 0.30MM R/A	491
1-84533-7 TE Connectivity AMP Connectors	CONN FFC TOP 17POS 1.25MM R/A	0
046866761000846+ KYOCERA Corporation	0.2MM PITCH - 61 POS - RT ANGLE	4658
62674-211121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 21POS 0.50MM SMD	1000
046810640001846+ KYOCERA Corporation	0.5MM PITCH - 40 POS - RT ANGLE	1367

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities