FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
5-1734592-0 TE Connectivity AMP Connectors	CONN FPC BOTTOM 50POS 0.50MM R/A	158
0015474030 Woodhead - Molex	CONN CIC FFC RCPT 3POS 2.54MM	0
FH28-55S-0.5SH(98) Hirose	CONN FFC BOTTOM 55POS 0.50MM R/A	0
FH52E-40S-0.5SH(99) Hirose	CONN FFC 40POS .5MM	355
0545501033 Woodhead - Molex	CONN FFC TOP 10POS 0.50MM R/A	10558
62674-261121ALF Storage & Server IO (Amphenol ICC)	CONN FFC VERT 26POS 0.50MM SMD	877
0522712869 Woodhead - Molex	CONN FPC BOTTOM 28POS 1.00MM R/A	1705
2-84952-4 TE Connectivity AMP Connectors	CONN FPC BOTTOM 24POS 1.00MM R/A	14215
0512812094 Woodhead - Molex	CONN FFC FPC 20POS 0.50MM R/A	8231
FH23-27S-0.3SHW(05) Hirose	CONN FPC BOTTOM 27POS 0.30MM R/A	6513
ZF5S-20-01-T-WT Samtec, Inc.	ZERO INSERTION FORCE .5MM ASSY	396
687144149022 Würth Elektronik Midcom	CONN .5MM HORZ BOTTOM SMD 44POS	1569
84952-5 TE Connectivity AMP Connectors	CONN FPC BOTTOM 5POS 1.00MM R/A	2353
FH12-10S-0.5SH(60) Hirose	CONN FFC BOTTOM 10POS 0.50MM R/A	0
HFW8S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 8POS 1MM SMD	0
SFW8R-4STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 8POS 1.00MM R/A	10635
84981-8 TE Connectivity AMP Connectors	CONN FFC FPC TOP 8POS 1.00MM R/A	6664
0522711569 Woodhead - Molex	CONN FPC BOTTOM 15POS 1.00MM R/A	4623
0039532114 Woodhead - Molex	CONN FFC TOP 11POS 1.25MM R/A	937
AYF334535 Panasonic	CONN FPC 45POS 0.30MM R/A	9184

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities