FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
XF2L-1335-1A Omron Electronics Components	CONN FPC BOTTOM 13POS 0.50MM R/A	1671
2-84952-7 TE Connectivity AMP Connectors	CONN FPC BOTTOM 27POS 1.00MM R/A	3527
AYF335165A Panasonic	CONN FPC 51POS 0.30MM R/A	10
FH35C-17S-0.3SHW(10) Hirose	CONN FPC 17POS .3MM	0
046809615210846+ KYOCERA Corporation	0.5MM PITCH - 15 POS - RT ANGLE	3960
1-84952-6 TE Connectivity AMP Connectors	CONN FPC BOTTOM 16POS 1.00MM R/A	5701
046232108103800+ KYOCERA Corporation	CONN FFC FPC TOP 8POS 1.00MM R/A	0
FH19SC-13S-0.5SH(99) Hirose	CONN FFC BOTTOM 13POS 0.50MM R/A	0
0526102433 Woodhead - Molex	CONN FPC VERT 24POS 1.00MM SMD	927
686120188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	2968
FH33J-18S-0.5SH(10) Hirose	CONN FFC BOTTOM 18POS 0.50MM R/A	0
0528061310 Woodhead - Molex	CONN FPC VERT 13POS 1.00MM PCB	11
AYF530665TA Panasonic	CONN FPC 6POS 0.50MM R/A	1022
PCA-6-LA-20-HL-3 Adam Tech	FPC/FFC CONNECTOR ZIF TYPE .5M	703
SFW18R-1STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 18POS 1.00MM R/A	2269
FA5S016HP1 JAE Electronics	CONN FPC BOTTOM 16POS 0.50MM R/A	0
0527452033 Woodhead - Molex	CONN FFC TOP 20POS 0.50MM R/A	5939
XF2W-2015-1A Omron Electronics Components	CONN FPC 20POS 0.50MM R/A	762
10051922-1010ELF Storage & Server IO (Amphenol ICC)	CONN FPC BOTTOM 10POS 0.50MM R/A	727
FH52-32S-0.5SH(99) Hirose	CONN FFC BOTTOM 32POS 0.50MM R/A	66

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities