D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120169

1731120169

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

72

09691817420

09691817420

HARTING

D SUB MIXED FE 10A PL3 SOLD.POWE

40

204351-1

204351-1

TE Connectivity Aerospace Defense and Marine

CONN D-SUB SOCKET 22-28AWG CRIMP

25185

1731120280

1731120280

Woodhead - Molex

HIGH CURRENT SOLDER POT CONTACT

36

161A13389X

161A13389X

CONEC

CONN D-SUB PIN 20-24AWG CRIMP

10151

1688269

1688269

Phoenix Contact

CONN D-SUB PIN 8-10AWG SLDR CUP

6

1731120037

1731120037

Woodhead - Molex

CONN D-SUB SOCKET 8-10AWG CRIMP

30300

MDSPTS

MDSPTS

VEAM

CONN D-SUB PIN 26-28AWG CRIMP

0

1731120159

1731120159

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

0

309.23.2415.481

309.23.2415.481

COAX INSERTS FOR D-SUB - CABLE M

50

1731120036

1731120036

Woodhead - Molex

CONN D-SUB PIN 8-10AWG CRIMP

194

1731120318

1731120318

Woodhead - Molex

CONN D-SUB SOCKET GOLD

100

1688243

1688243

Phoenix Contact

CONN D-SUB PIN 12-14AWG SLDR CUP

3758

09692825420

09692825420

HARTING

CONN D-SUB PIN 16-20AWG CRIMP

273

132C11019X

132C11019X

CONEC

CONN D-SUB SOCKET 16-20AWG CRIMP

1168

DM130338

DM130338

VEAM

CONN D-SUB PIN 8AWG CRIMP GOLD

539

170-102-170L002

170-102-170L002

NorComp

CONN D-SUB SOCKET 24-28AWG CRIMP

2550

1731120336

1731120336

Woodhead - Molex

FCT TERM SIGN STAMPED PLG CRP 20

1000

L17-RR-D2-M-01-100

L17-RR-D2-M-01-100

Storage & Server IO (Amphenol ICC)

CONN D-SUB PIN 24-28AWG CRIMP

685

09691812550

09691812550

HARTING

CONN D-SUB SOCKET 20AWG SLDR

320

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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