D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
1731120734

1731120734

Woodhead - Molex

'FCT SIGN RCPT CRP 26-28AWG 8U''

1000

DM53740

DM53740

VEAM

CONN D-SUB PIN COAX CABLE CRIMP

100

5-166052-1

5-166052-1

TE Connectivity AMP Connectors

CONN D-SUB SOCKET 24-28AWG CRIMP

2538

1731120042

1731120042

Woodhead - Molex

CONN D-SUB PIN 8-12AWG SLDR CUP

0

09691817821

09691817821

HARTING

D SUB MIXED MA 20A PL3 SOLDER PO

59

1731120999

1731120999

Woodhead - Molex

HIGH CURRENT CRIMP CONTACT (30A)

200

1731120047

1731120047

Woodhead - Molex

CONN D-SUB SOCKET COAX GOLD

95

166052-1

166052-1

TE Connectivity AMP Connectors

CONN D-SUB SOCKET 24-28AWG CRIMP

6055

5115.24.1015.403

5115.24.1015.403

HIGH POWER INSERTS - PCB MOUNT P

100

206795-3

206795-3

TE Connectivity Aerospace Defense and Marine

CONN D-SUB SOCKET 26-28AWG CRIMP

1425

1727040147

1727040147

Woodhead - Molex

CONN D-SUB PIN 12-16AWG SLDR CUP

1007

7918-PIN-F-10K

7918-PIN-F-10K

Oupiin

HD D-SUB CRIMP TYPE PINS, FEMALE

1000

DM511578

DM511578

VEAM

CONN D-SUB PIN 20AWG SLDR GOLD

1951

09670003676

09670003676

HARTING

D-SUB, FE HIGH-END AWG 18-22 CRI

63

340100502B

340100502B

C&K

CONN D-SUB SOCKET CRIMP

385

09670008287

09670008287

HARTING

CONN D-SUB PIN 20-24AWG 1=1000PC

3

166051-1

166051-1

TE Connectivity AMP Connectors

CONN D-SUB SOCKET 20-24AWG CRIMP

2666

170-001-170L001

170-001-170L001

NorComp

CONN D-SUB PIN 24-28AWG CRIMP

64095

161A13439X

161A13439X

CONEC

CONN D-SUB PIN 24-28AWG CRIMP

1950

09692817421

09692817421

HARTING

CONN D-SUB PIN SLDR CUP GOLD

269

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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