D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
5-228618-1

5-228618-1

TE Connectivity Aerospace Defense and Marine

CONN D-SUB PIN COAX CABLE CRIMP

117

09691815233

09691815233

HARTING

CONN D-SUB SOCKET COAXIAL CABLE

0

09691817143

09691817143

HARTING

D SUB MIXED FE SOLDER CRIMP COAX

36

8656351064LF

8656351064LF

Storage & Server IO (Amphenol ICC)

CONN D-SUB SOCKET 24-28AWG CRIMP

1196

330-5291-050

330-5291-050

VEAM

CONN D-SUB PIN 26-30AWG CRIMP

6347

131C11029X

131C11029X

CONEC

CONN D-SUB PIN 12-14AWG CRIMP

5192

1731120214

1731120214

Woodhead - Molex

CONN D-SUB SOCKET 20-24AWG CRIMP

1903

09560008165

09560008165

HARTING

CONN D-SUB PIN 24-26AWG CRIMP

0

1727040156

1727040156

Woodhead - Molex

CONN D-SUB SCKT 8-12AWG SLDR CUP

1960

1731120269

1731120269

Woodhead - Molex

HIGH CURRENT SOLDER POT CONTACT

345

1727040135

1727040135

Woodhead - Molex

CONN D-SUB SOCKET 20AWG SLDR CUP

609

132C10029X

132C10029X

CONEC

CONN DSUB SCKT 12-14AWG SLDR CUP

2458

132A15019X

132A15019X

CONEC

CONN D-SUB SOCKET 20-24AWG CRIMP

22420

132C10019X

132C10019X

CONEC

CONN DSUB SCKT 16-20AWG SLDR CUP

1601

1731120202

1731120202

Woodhead - Molex

CONN D-SUB PIN 20-24AWG CRIMP

2575

09670008570

09670008570

HARTING

CONN D-SUB PIN 20-24AWG CRIMP

0

09691815421

09691815421

HARTING

CONN D-SUB SOCKET SLDR CUP GOLD

11

1731120054

1731120054

Woodhead - Molex

CONN D-SUB PIN COAX GOLD

5

09670008470

09670008470

HARTING

CONN D-SUB SOCKET 2-20AWG CRIMP

109

D130344

D130344

VEAM

CONN D-SUB SCKT COAX CABLE CRIMP

159

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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