D-Sub, D-Shaped Connectors - Contacts

Image Part Number Description / PDF Quantity Rfq
2029354000

2029354000

Woodhead - Molex

MCAT MIDPOWER MALE 26-28AWG, 1.3

0

1731120079

1731120079

Woodhead - Molex

CONN D-SUB PIN PCB GOLD

90

1731120721

1731120721

Woodhead - Molex

PLUG FCT CRP 26-28AWG 8U

1000

09692817143

09692817143

HARTING

D SUB MIXED MA SOLDER CRIMP COAX

20

1731120034

1731120034

Woodhead - Molex

CONN D-SUB PIN 12-14AWG CRIMP

385

0830009502

0830009502

Woodhead - Molex

CONN D-SUB SOCKET 26-28AWG CRIMP

5

DM130340

DM130340

VEAM

CONN D-SUB PIN 16AWG CRIMP GOLD

1005

40-9428F

40-9428F

Vitelec / Cinch Connectivity Solutions

CONN D-SUB SOCKET CRIMP 1=100

1

DM537405

DM537405

VEAM

CONN D-SUB PIN COAX CABLE CRIMP

28

1731120912

1731120912

Woodhead - Molex

FCT TERM HPWR

190

0579196702

0579196702

Woodhead - Molex

CONN D-SUB PIN 20-22AWG CRIMP

7019

212013-1

212013-1

TE Connectivity Aerospace Defense and Marine

CONN D-SUB PIN 16-18AWG CRIMP

246

09691815420

09691815420

HARTING

CONN D-SUB SOCKET SLDR CUP GOLD

8

L17DM53744207

L17DM53744207

Storage & Server IO (Amphenol ICC)

CONN D-SUB SOCKET CRIMP GOLD

2000

09670007277

09670007277

HARTING

CONN D-SUB SOCKET 24-28AWG CRIMP

1000

030-51307-001

030-51307-001

JAE Electronics

CONN CONTACT

746

1731120189

1731120189

Woodhead - Molex

CONN D-SUB SOCKET PCB GOLD

110

1731120255

1731120255

Woodhead - Molex

FCT SCREW M3 17.5 NI

0

1731120386

1731120386

Woodhead - Molex

FCT TERM HPWR SDR RCPT 20 AMP 12

100

170-002-170L001

170-002-170L001

NorComp

CONN D-SUB SOCKET 24-28AWG CRIMP

30000

D-Sub, D-Shaped Connectors - Contacts

1. Overview

D-Subminiature connectors, commonly referred to as D-Sub or D-Shaped connectors, are electrical connectors featuring a D-shaped metal shield. They are widely used for data, signal, and power transmission in industrial, computing, and communication systems. Their robust design ensures reliable electrical continuity and mechanical stability in demanding environments.

2. Main Types and Functional Classification

TypeFunction FeaturesApplication Examples
DE-99-pin configuration, compact sizeRS-232 serial interfaces, PC COM ports
DB-2525-pin configuration, parallel signal transmissionOlder printer ports, industrial control systems
DC-3737-pin high-density arrangementMilitary equipment, test instrumentation
HD D-SubHigh-density double-row contactsVideo graphics (VGA), industrial automation

3. Structure and Components

Typical D-Sub connectors consist of: - Metal Shell: Zinc alloy or steel housing with EMI shielding - Insulator: High-temperature resistant thermoplastic or ceramic - Contact Arrangement: Male pins (plug) or female sockets (jack) in staggered rows - Mounting Hardware: Threaded or snap-in fixing mechanisms Contacts are usually made of phosphor bronze or beryllium copper with gold/tin plating for corrosion resistance.

4. Key Technical Specifications

ParameterTypical RangeSignificance
Current Rating1-5 A per contactDetermines power handling capacity
Voltage Rating50-600 V AC/DCEnsures dielectric strength
Contact Resistance 10 m Impacts signal integrity
Insulation Resistance 1000 M Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental durability

5. Application Fields

  • Computer peripherals (monitors, keyboards)
  • Industrial automation (PLCs, sensors)
  • Telecommunications (modems, routers)
  • Aerospace (avionics systems)
  • Test and measurement equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityDEUTSCH D-Sub series with EMI filtering
AmphenolHigh-density HD D-Sub 90-position connectors
MolexMicro D-Sub for compact industrial applications
SamtecHigh-speed D-Sub with 10 Gbps data rate

7. Selection Guidelines

  • Verify current/voltage requirements against contact ratings
  • Choose shell size based on pin count needs
  • Consider locking mechanisms for vibration-prone environments
  • Specify plating material for corrosion resistance
  • Ensure compliance with industry standards (e.g., MIL-DTL-24308)

8. Industry Trends

Key developments include miniaturization (sub-D connectors), hybrid designs integrating USB-C/HDMI signals, improved EMI shielding for 5G applications, and surface-mount technology (SMT) compatibility. Environmental regulations drive adoption of RoHS-compliant materials and lead-free plating solutions.

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