Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
XC5E20812DBYOMR

XC5E20812DBYOMR

Omron Electronics Components

CONN DIN PLUG 20POS

0

XC5B-5021

XC5B-5021

Omron Electronics Components

CONN DIN RCPT 50POS PCB GOLD

37

XC5A16821ABYOMR

XC5A16821ABYOMR

Omron Electronics Components

CONN DIN PLUG 16POS PCB RA

0

XC5B-3031-3

XC5B-3031-3

Omron Electronics Components

CONN DIN RCPT 30POS PCB GOLD

40

XC5D9621A22BYOMR

XC5D9621A22BYOMR

Omron Electronics Components

CONN DIN RCPT 96POS

0

XC5B-6421

XC5B-6421

Omron Electronics Components

CONN DIN RCPT 64POS PCB GOLD

0

XC5B-2021-A

XC5B-2021-A

Omron Electronics Components

CONN DIN RCPT 20POS PCB GOLD

160

XC5B-6431-0A

XC5B-6431-0A

Omron Electronics Components

CONN DIN RCPT 64POS PCB GOLD

27

XC5B64210ABYOMR

XC5B64210ABYOMR

Omron Electronics Components

CONN DIN RCPT 64POS PCB

0

XC5A6482ABYOMR

XC5A6482ABYOMR

Omron Electronics Components

CONN DIN PLUG 64POS PCB RA

0

XC5C6422ABYOMR

XC5C6422ABYOMR

Omron Electronics Components

CONN DIN PLUG 64POS PCB RA

0

XC5E32812ABYOMR

XC5E32812ABYOMR

Omron Electronics Components

CONN DIN PLUG 32POS

0

XC5A30821ABYOMR

XC5A30821ABYOMR

Omron Electronics Components

CONN DIN PLUG 30POS PCB RA

0

XC5C-4822

XC5C-4822

Omron Electronics Components

CONN DIN PLUG 48POS PCB RA GOLD

151

XC5G6421BYOMR

XC5G6421BYOMR

Omron Electronics Components

CONN DIN PLUG 64POS PCB

0

XC5C-5C-6422

XC5C-5C-6422

Omron Electronics Components

CONN DIN PLUG 44POS PCB RA

0

XC5A-5082-1

XC5A-5082-1

Omron Electronics Components

CONN DIN PLUG 50POS PCB RA GOLD

29

XC5E-2021-2

XC5E-2021-2

Omron Electronics Components

CONN DIN PLUG 20POS PCB GOLD

0

XC5A20221ABYOMR

XC5A20221ABYOMR

Omron Electronics Components

CONN DIN PLUG 20POS PCB RA

0

XC5B5031BYOMR

XC5B5031BYOMR

Omron Electronics Components

CONN DIN RCPT 50POS PCB

0

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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