Backplane Connectors - DIN 41612

Image Part Number Description / PDF Quantity Rfq
XC5A24821ABYOMR

XC5A24821ABYOMR

Omron Electronics Components

CONN DIN PLUG 24POS PCB RA

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XC5E01812BYOMR

XC5E01812BYOMR

Omron Electronics Components

CONN DIN PLUG 100POS

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XC5A-5022A

XC5A-5022A

Omron Electronics Components

CONN DIN PLUG 50POS PCB RA GOLD

0

XC5D3221ABYOMR

XC5D3221ABYOMR

Omron Electronics Components

CONN DIN RCPT 32POS

0

XC5B-5021A

XC5B-5021A

Omron Electronics Components

CONN DIN RCPT 50POS PCB GOLD

0

XC5E44812BYOMR

XC5E44812BYOMR

Omron Electronics Components

CONN DIN PLUG 44POS

0

XC5A-0182-1

XC5A-0182-1

Omron Electronics Components

CONN DIN PLUG 100POS PCB RA GOLD

14

XC5A01821ABYOMR

XC5A01821ABYOMR

Omron Electronics Components

CONN DIN PLUG 100POS PCB RA

0

XC5E-2081-2

XC5E-2081-2

Omron Electronics Components

CONN DIN PLUG 20POS PCB GOLD

0

XC5E64812BYOMR

XC5E64812BYOMR

Omron Electronics Components

CONN DIN PLUG 64POS

0

XC5B14313BYOMR

XC5B14313BYOMR

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CONN DIN RCPT 14POS PCB

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XC5H6422ABYOMR

XC5H6422ABYOMR

Omron Electronics Components

CONN DIN RCPT 64POS PCB RA

0

XC5B-4431-0A

XC5B-4431-0A

Omron Electronics Components

CONN DIN RCPT 44POS PCB GOLD

31

XC5A-2082-1

XC5A-2082-1

Omron Electronics Components

CONN DIN PLUG 20POS PCB RA GOLD

157

XC5M-0222

XC5M-0222

Omron Electronics Components

CONN DIN PLUG 128POS PCB RA GOLD

18

XC5F-0122

XC5F-0122

Omron Electronics Components

CONN DIN RCPT 100POS PCB RA GOLD

0

XC5H-4822

XC5H-4822

Omron Electronics Components

CONN DIN RCPT 48POS PCB RA GOLD

0

XC5F3222ABYOMR

XC5F3222ABYOMR

Omron Electronics Components

CONN DIN RCPT 32POS PCB RA GOLD

0

XC5D-9621

XC5D-9621

Omron Electronics Components

CONN DIN RCPT 96POS PCB GOLD

1

XC5H4822ABYOMR

XC5H4822ABYOMR

Omron Electronics Components

CONN DIN RCPT 48POS PCB RA

0

Backplane Connectors - DIN 41612

1. Overview

DIN 41612 connectors are standardized electrical connectors defined by the German Institute for Standardization (DIN). They are widely used in industrial electronics, telecommunications, and computer systems for establishing reliable connections between printed circuit boards (PCBs) and backplanes. These connectors enable modular system design, allowing easy maintenance and scalability in complex electronic systems.

2. Main Types & Functional Classification

TypeFunctionApplication Examples
Type ARectangular contacts, 3.2mm pitchGeneral-purpose industrial equipment
Type BDouble-ended contacts for PCB stackingTelecom switching systems
Type CHigh-density 2.54mm pitch contactsData center servers
Type FShielded contacts for high-speed signalsIndustrial automation controllers

3. Structure & Composition

DIN 41612 connectors feature: - Contact System: Phosphor bronze or beryllium copper contacts with gold plating - Insulation Body: Thermoplastic materials (e.g., PA66) with high temperature resistance - Fixing Mechanism: Metal latches and polarization keys to prevent misalignment - Shielding: Optional EMI shielding for high-frequency applications

4. Key Technical Specifications

ParameterValue RangeImportance
Current Rating1-5A per contactDetermines power transmission capacity
Contact Resistance 10m Affects signal integrity
Operating Voltage50-250V ACSafety and insulation requirement
Temperature Range-40 C to +125 CEnvironmental reliability
Insertion Force2-10N per contactAssembly and maintenance consideration

5. Application Fields

  • Telecommunications: Switching systems, routers
  • Industrial Automation: PLC controllers, CNC machines
  • Computer Systems: Server racks, mainframe computers
  • Medical Equipment: Diagnostic imaging systems
  • Transportation: Railway signaling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Feature
AmphenolDIN41612R32-03232-position high-vibration resistance
TE Connectivity1-1416128Shielded Type F connector
SamtecDIN-41612-3MM3mm pitch miniaturized design
Weidm ller1846030000Corrosion-resistant industrial version

7. Selection Guidelines

  1. Determine current/voltage requirements based on system power budget
  2. Select contact pitch according to PCB space constraints
  3. Consider environmental factors (temperature, humidity, vibration)
  4. Verify compatibility with existing backplane standards
  5. Evaluate shielding needs for high-frequency applications

8. Industry Trends

Key development directions include: - Miniaturization with 2mm pitch connectors entering mainstream adoption - Increased support for high-speed data transmission (>10Gbps) - Integration of hybrid power/signal contact designs - Enhanced materials for RoHS compliance and thermal management - Smart connectors with integrated diagnostic capabilities

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