TVS - Diodes

Image Part Number Description / PDF Quantity Rfq
PESD5V0U1UCL,315

PESD5V0U1UCL,315

NXP Semiconductors

TVS DIODE SOD882

0

IP4302CX2/LF,315

IP4302CX2/LF,315

NXP Semiconductors

TVS DIODE 2CSP

0

IP4303CX4/LF,135

IP4303CX4/LF,135

NXP Semiconductors

TVS DIODE 4CSP

0

IP4332CX5/LF,135

IP4332CX5/LF,135

NXP Semiconductors

TVS DIODE 5WLCSP

0

IP4357CX17,135

IP4357CX17,135

NXP Semiconductors

TVS DIODE 17CSP

0

PESD24VS2UT/ZLR

PESD24VS2UT/ZLR

NXP Semiconductors

DIODE ESD SOT23

0

PESD5V0S1BA/ZLX

PESD5V0S1BA/ZLX

NXP Semiconductors

DIODE ESD PROTECT SOD323

0

PESD5V2S2UT/ZLR

PESD5V2S2UT/ZLR

NXP Semiconductors

DIODE ESD PROTECT SOT23

0

IP4062CX18/LF,135

IP4062CX18/LF,135

NXP Semiconductors

TVS DIODE 18CSP

0

PESD5V0C1USF/S50YL

PESD5V0C1USF/S50YL

NXP Semiconductors

DIODE ESD BIDIRECT SOD962

0

PESD5V0C1BSF/S50YL

PESD5V0C1BSF/S50YL

NXP Semiconductors

DIODE ESD BIDIRECT SOD962

0

TVS - Diodes

1. Overview

Transient Voltage Suppression (TVS) Diodes are semiconductor devices designed to protect sensitive electronics from voltage spikes caused by ESD (electrostatic discharge), lightning, or switching events. By clamping transient voltages to safe levels, TVS diodes ensure circuit reliability in modern electronic systems. Their fast response time (<1ps) and low clamping voltage make them critical components in high-speed data lines, power supplies, and automotive electronics.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Unidirectional TVSSingle-polarity protection, asymmetrical voltage responseDC power lines, automotive systems
Bidirectional TVSSymmetrical protection for AC signalsTelecom interfaces (e.g., RJ45), USB 3.0 Multichannel TVSMultiple protection paths in single packageHDMI ports, DisplayPort interfaces Automotive TVSAEC-Q101 qualified, high surge capabilityECU modules, CAN bus protection

3. Structure and Composition

TVS diodes utilize a PN junction semiconductor structure with optimized doping profiles. Key components include:

  • Silicon epitaxial layer for precise voltage control
  • Passivation layer (SiO2/Nitride) to reduce leakage current
  • Backside metallization for low-inductance packaging
  • DO-214, SOD-123, or WCSP packaging variants

4. Key Technical Specifications

ParameterDescriptionImportance
Breakdown Voltage (Vbr)Minimum voltage where TVS activatesDetermines protection threshold
Clamping Voltage (Vc)Max voltage during transient eventMust be below protected IC's max rating
Peak Pulse Current (Ipp)Maximum surge current handlingDefines robustness against large transients
Response Time (tresp)Time to switch from off to on stateCrucial for ESD protection (typically <1ps)
Leakage Current (Ir)Off-state current at working voltageImpacts power efficiency

5. Application Areas

Major industries and typical equipment:

  • Telecommunications: 5G base stations, optical transceivers
  • Automotive: CAN/LIN bus protection, ADAS sensors
  • Industrial: PLCs, motor drives
  • Consumer Electronics: USB Type-C interfaces, Wi-Fi modules
  • Renewable Energy: Solar inverters, wind turbine controllers

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
LittelfuseSP301x SeriesUSB 3.1 Gen2 protection, 0.35pF capacitance
ON SemiconductorNUP410606-channel ESD protection, 30kV HBM
STMicroelectronicsESDA8401Automotive-grade, 150A surge rating
InfineonESD320Single-line protection, 0.25pF for HDMI 2.1

7. Selection Guidelines

Key considerations:

  • Operating voltage must be below Vbr (typically 1.1 Voper)
  • Clamping voltage should stay under protected IC's maximum ratings
  • Packaging selection based on board space and thermal requirements
  • Environmental factors: temperature range, humidity resistance
  • Compliance with standards (IEC 61000-4-2, ISO 10605)

Example: For a 12V automotive circuit, select a bidirectional TVS with Vbr=15V, Vc<30V, and Ipp>50A to handle load dump events.

8. Industry Trends

Key development directions:

  • Miniaturization: 0201 package (0.6 0.3mm) for mobile devices
  • Integration: Combo devices with filters and shielding
  • Higher robustness: 40kV+ ESD protection for industrial IoT
  • Advanced materials: Silicon carbide (SiC) for high-temperature applications
  • AI-driven selection tools for optimized component matching
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