Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2205116-3

2205116-3

TE Connectivity AMP Connectors

CA 200MM 12 POS. MOW-PB M-M VALU

31

A3DDH-2436G

A3DDH-2436G

TE Connectivity AMP Connectors

IDC CABLE - AKR24H/AE24G/AKR24H

0

A3AAH-1406M

A3AAH-1406M

TE Connectivity AMP Connectors

IDC CABLE - ASC14H/AE14M/ASC14H

0

A3AAB-1406M

A3AAB-1406M

TE Connectivity AMP Connectors

IDC CABLE- ASC14B/AE14M/ASC14B

0

A3BKB-1006M

A3BKB-1006M

TE Connectivity AMP Connectors

IDC CABLE- ASR10B/AE10M/APK10B

0

A2MXS-5006M

A2MXS-5006M

TE Connectivity AMP Connectors

ADM50S/AE50M/X

0

A1RXB-3036M

A1RXB-3036M

TE Connectivity AMP Connectors

IDC CABLE - APR30B/AE30M/X

0

A2MXS-1436M

A2MXS-1436M

TE Connectivity AMP Connectors

ADM14S/AE14M/X

0

2205073-2

2205073-2

TE Connectivity AMP Connectors

CABLE ASSEMBLY HEADER WTB 14POS

25

A3DDB-6036G

A3DDB-6036G

TE Connectivity AMP Connectors

IDC CABLE- AKR60B/AE60G/AKR60B

0

A3BBB-1436G

A3BBB-1436G

TE Connectivity AMP Connectors

IDC CABLE- ASR14B/AE14G/ASR14B

0

A3CCB-6418G

A3CCB-6418G

TE Connectivity AMP Connectors

IDC CABLE- AKC64B/AE64G/AKC64B

0

2205076-2

2205076-2

TE Connectivity AMP Connectors

CABLE ASSEMBLY HEADER WTW 20POS

491

A3BBH-3436G

A3BBH-3436G

TE Connectivity AMP Connectors

IDC CABLE - ASR34H/AE34M/ASR34H

0

1969343-5

1969343-5

TE Connectivity AMP Connectors

2POS CT LEAD ASSY DOUBLE 150MM

1434

A3CCB-1436G

A3CCB-1436G

TE Connectivity AMP Connectors

IDC CABLE- AKC14B/AE14G/AKC14B

0

A1DXB-5036M

A1DXB-5036M

TE Connectivity AMP Connectors

IDC CABLE- AKR50B/AE50M/X

0

A1CXB-2636M

A1CXB-2636M

TE Connectivity AMP Connectors

IDC CABLE- AKC26B/AE26M/X

0

A3DDH-1606G

A3DDH-1606G

TE Connectivity AMP Connectors

IDC CABLE - AKR16H/AE16G/AKR16H

0

A1CXB-5036M

A1CXB-5036M

TE Connectivity AMP Connectors

IDC CABLE- AKC50B/AE50M/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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