Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A2MXS-2436M

A2MXS-2436M

TE Connectivity AMP Connectors

ADM24S/AE24M/X

0

A3CCH-5018G

A3CCH-5018G

TE Connectivity AMP Connectors

IDC CABLE - AKC50H/AE50G/AKC50H

0

A8MMS-6436G

A8MMS-6436G

TE Connectivity AMP Connectors

ADM64S/AE64G/ADM64S

0

A3BBH-5018G

A3BBH-5018G

TE Connectivity AMP Connectors

IDC CABLE - ASR50H/AE50G/ASR50H

0

A3DDB-5006M

A3DDB-5006M

TE Connectivity AMP Connectors

IDC CABLE- AKR50B/AE50M/AKR50B

0

A2MXS-1418G

A2MXS-1418G

TE Connectivity AMP Connectors

ADM14S/AE14G/X

0

A3AAH-5006M

A3AAH-5006M

TE Connectivity AMP Connectors

IDC CABLE - ASC50H/AE50M/ASC50H

0

A2MXS-6018M

A2MXS-6018M

TE Connectivity AMP Connectors

ADM60S/AE60M/X

0

A1CXH-2436M

A1CXH-2436M

TE Connectivity AMP Connectors

IDC CABLE - AKC24H/AE24M/X

0

A3RRB-2636G

A3RRB-2636G

TE Connectivity AMP Connectors

IDC CABLE - APR26B/AE26G/APR26B

0

A3AAB-2036M

A3AAB-2036M

TE Connectivity AMP Connectors

IDC CABLE- ASC20B/AE20M/ASC20B

0

A1AXH-5036M

A1AXH-5036M

TE Connectivity AMP Connectors

IDC CABLE - ASC50H/AE50M/X

0

A3DDH-3406M

A3DDH-3406M

TE Connectivity AMP Connectors

IDC CABLE - AKR34H/AE34M/AKR34H

0

A1AXB-2636G

A1AXB-2636G

TE Connectivity AMP Connectors

IDC CABLE- ASC26B/AE26G/X

0

A3DDB-4006G

A3DDB-4006G

TE Connectivity AMP Connectors

IDC CABLE- AKR40B/AE40G/AKR40B

0

A2MXS-4018M

A2MXS-4018M

TE Connectivity AMP Connectors

ADM40S/AE40M/X

1

1483351-2

1483351-2

TE Connectivity AMP Connectors

MICRO-MATCH LEAD 06P 150MM

1264

A3BRB-1436G

A3BRB-1436G

TE Connectivity AMP Connectors

IDC CABLE - ASR14B/AE14G/APR14B

0

A3RRB-3018M

A3RRB-3018M

TE Connectivity AMP Connectors

IDC CABLE - APR30B/AE30M/APR30B

0

A3BBH-6406M

A3BBH-6406M

TE Connectivity AMP Connectors

IDC CABLE - ASR64H/AE64M/ASR64H

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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