Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A04KR04DS28W305B

A04KR04DS28W305B

JST

JUMPER 04DS-8E - 04KR-8M-P 12"

395

A12SUR12SUR32W254A

A12SUR12SUR32W254A

JST

JUMPER 12SUR-32S - 12SUR-32S 10"

1511

A02SR02SR30K305B

A02SR02SR30K305B

JST

JUMPER 02SR-3S - 02SR-3S 12"

5061

A05KR05KR26E152A

A05KR05KR26E152A

JST

JUMPER 05KR-6S-P - 05KR-6S-P 6"

430

A01RSFP16K305B

A01RSFP16K305B

JST

JUMPER RSFP-LP-1V-250 12"

0

A08KR08KR26E102A

A08KR08KR26E102A

JST

JUMPER 08KR-6S-P - 08KR-6S-P 4"

1183

A02DS02DS28W51B

A02DS02DS28W51B

JST

JUMPER 02DS-8E - 02DS-8E 2"

1000

A08SUR08SUR32W254A

A08SUR08SUR32W254A

JST

JUMPER 08SUR-32S - 08SUR-32S 10"

1440

A06KR06DA28W305B

A06KR06DA28W305B

JST

JUMPER 06DA-8M - 06KR-8M-P 12"

279

A07SR07SR30K152B

A07SR07SR30K152B

JST

JUMPER 07SR-3S - 07SR-3S 6"

941

A11KR11KR26E51A

A11KR11KR26E51A

JST

JUMPER 11KR-6S-P - 11KR-6S-P 2"

562

A08SUR08SUR32W102B

A08SUR08SUR32W102B

JST

JUMPER 08SUR-32S - 08SUR-32S 4"

1499

A02KR02KR26E51B

A02KR02KR26E51B

JST

JUMPER 02KR-6S-P - 02KR-6S-P 2"

4493

A06SUR06SUR32W152A

A06SUR06SUR32W152A

JST

JUMPER 06SUR-32S - 06SUR-32S 6"

714

A14SR14SR30K254A

A14SR14SR30K254A

JST

JUMPER 14SR-3S - 14SR-3S 10"

999

A09ZR09ZR28H102B

A09ZR09ZR28H102B

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 4"

995

A13SR13SR30K51A

A13SR13SR30K51A

JST

JUMPER 13SR-3S - 13SR-3S 2"

978

A10XSR10XSR36R295A

A10XSR10XSR36R295A

JST

JUMPER 10XSR-36S - 10XSR-36S 11.

898

A05XAF05XAF22K102B

A05XAF05XAF22K102B

JST

JUMPER 05XAF-2S - 05XAF-2S 4"

852

A08SUR08SUR32W203A

A08SUR08SUR32W203A

JST

JUMPER 08SUR-32S - 08SUR-32S 8"

1908

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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