Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A06SR06SR30K51B

A06SR06SR30K51B

JST

JUMPER 06SR-3S - 06SR-3S 2"

2445

A12SUR12SUR32W254B

A12SUR12SUR32W254B

JST

JUMPER 12SUR-32S - 12SUR-32S 10"

846

A04XSR04XSR36R152B

A04XSR04XSR36R152B

JST

JUMPER 04XSR-36S - 04XSR-36S 6"

955

A07SR07SR30K102B

A07SR07SR30K102B

JST

JUMPER 07SR-3S - 07SR-3S 4"

639

A02XSR02XSR36R254B

A02XSR02XSR36R254B

JST

JUMPER 02XSR-36S - 02XSR-36S 10"

1000

A09SR09SR30K51A

A09SR09SR30K51A

JST

JUMPER 09SR-3S - 09SR-3S 2"

1600

A09ZR09ZR28H152A

A09ZR09ZR28H152A

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 6"

1000

A06SR06SR30K152A

A06SR06SR30K152A

JST

JUMPER 06SR-3S - 06SR-3S 6"

5224

A07SR07SR30K203B

A07SR07SR30K203B

JST

JUMPER 07SR-3S - 07SR-3S 8"

981

A06KR06DA28W152B

A06KR06DA28W152B

JST

JUMPER 06DA-8M - 06KR-8M-P 6"

371

A05SUR05SUR32W203A

A05SUR05SUR32W203A

JST

JUMPER 05SUR-32S - 05SUR-32S 8"

955

A12SUR12SUR32W203A

A12SUR12SUR32W203A

JST

JUMPER 12SUR-32S - 12SUR-32S 8"

739

A09ZR09ZR28H152B

A09ZR09ZR28H152B

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 6"

972

A22XSR22XSR36R102B

A22XSR22XSR36R102B

JST

JUMPER 22XSR-36S - 22XSR-36S 4"

987

A02SUR02SUR32W51A

A02SUR02SUR32W51A

JST

JUMPER 02SUR-32S - 02SUR-32S 2"

1158

A20XSR20XSR36R254A

A20XSR20XSR36R254A

JST

JUMPER 20XSR-36S - 20XSR-36S 10"

975

A05KR05KR26E305B

A05KR05KR26E305B

JST

JUMPER 05KR-6S-P - 05KR-6S-P 12"

0

A02KR02DS28W152B

A02KR02DS28W152B

JST

JUMPER 02DS-8E - 02KR-8M-P 6"

44

A06XAF06XAF22K51A

A06XAF06XAF22K51A

JST

JUMPER 06XAF-2S - 06XAF-2S 2"

84

A03SR03SR30K203A

A03SR03SR30K203A

JST

JUMPER 03SR-3S - 03SR-3S 8"

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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