Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A17SUR17SUR32W305A

A17SUR17SUR32W305A

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JUMPER 17SUR-32S - 17SUR-32S 12"

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A14KR14DA28W51B

A14KR14DA28W51B

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JUMPER 14DA-8M - 14KR-8M-P 2"

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A17SUR17SUR32W51B

A17SUR17SUR32W51B

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JUMPER 17SUR-32S - 17SUR-32S 2"

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A22SUR22SUR32W305B

A22SUR22SUR32W305B

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JUMPER 22SUR-32S - 22SUR-32S 12"

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A17SUR17SUR32W152B

A17SUR17SUR32W152B

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JUMPER 17SUR-32S - 17SUR-32S 6"

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A20SUR20SUR32W152B

A20SUR20SUR32W152B

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JUMPER 20SUR-32S - 20SUR-32S 6"

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A15DS15DS28W305B

A15DS15DS28W305B

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JUMPER 15DS-8E - 15DS-8E 12"

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A05SSR05SSR32E152B

A05SSR05SSR32E152B

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JUMPER 05SSR-32H - 05SSR-32H 6"

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A14KR14DS28W254B

A14KR14DS28W254B

JST

JUMPER 14DS-8E - 14KR-8M-P 10"

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A15DS15DS28W51B

A15DS15DS28W51B

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JUMPER 15DS-8E - 15DS-8E 2"

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A13DS13DS28W152B

A13DS13DS28W152B

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JUMPER 13DS-8E - 13DS-8E 6"

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A06SSR06SSR32E254B

A06SSR06SSR32E254B

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JUMPER 06SSR-32H - 06SSR-32H 10"

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A10KR10DA28W305B

A10KR10DA28W305B

JST

JUMPER 10DA-8M - 10KR-8M-P 12"

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A15KR15DA28W152B

A15KR15DA28W152B

JST

JUMPER 15DA-8M - 15KR-8M-P 6"

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A16SUR16SUR32W152B

A16SUR16SUR32W152B

JST

JUMPER 15SUR-32S - 16SUR-32S 6"

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A11DS11DS28W152B

A11DS11DS28W152B

JST

JUMPER 11DS-8E - 11DS-8E 6"

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A06SSR06SSR32E305B

A06SSR06SSR32E305B

JST

JUMPER 06SSR-32H - 06SSR-32H 12"

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A08SSR08SSR32E203B

A08SSR08SSR32E203B

JST

JUMPER 08SSR-32H - 08SSR-32H 8"

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A15KR15DS28W203B

A15KR15DS28W203B

JST

JUMPER 15DS-8E - 15KR-8M-P 8"

0

A10KR10DA28W51B

A10KR10DA28W51B

JST

JUMPER 10DA-8M - 10KR-8M-P 2"

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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