Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A13KR13DS28W51B

A13KR13DS28W51B

JST

JUMPER 13DS-8E - 13KR-8M-P 2"

0

A10SSR10SSR32E102B

A10SSR10SSR32E102B

JST

JUMPER 10SSR-32H - 10SSR-32H 4"

0

A11SSR11SSR32E305B

A11SSR11SSR32E305B

JST

JUMPER 11SSR-32H - 11SSR-32H 12"

0

A09SSR09SSR32E152B

A09SSR09SSR32E152B

JST

JUMPER 09SSR-32H - 09SSR-32H 6"

0

A14KR14DS28W305B

A14KR14DS28W305B

JST

JUMPER 14DS-8E - 14KR-8M-P 12"

0

A22SUR22SUR32W152A

A22SUR22SUR32W152A

JST

JUMPER 22SUR-32S - 22SUR-32S 6"

0

A14SSR14SSR32E305B

A14SSR14SSR32E305B

JST

JUMPER 14SSR-32H - 14SSR-32H 12"

0

A15SUR15SUR32W51A

A15SUR15SUR32W51A

JST

JUMPER 15SUR-32S - 15SUR-32S 2"

0

A15SUR15SUR32W152A

A15SUR15SUR32W152A

JST

JUMPER 15SUR-32S - 15SUR-32S 6"

0

A14SUR14SUR32W152A

A14SUR14SUR32W152A

JST

JUMPER 14SUR-32S - 14SUR-32S 6"

0

A12SSR12SSR32E102B

A12SSR12SSR32E102B

JST

JUMPER 12SSR-32H - 12SSR-32H 4"

0

A17SUR17SUR32W305B

A17SUR17SUR32W305B

JST

JUMPER 17SUR-32S - 17SUR-32S 12"

0

A02XSR02XSR36R305A

A02XSR02XSR36R305A

JST

JUMPER 02XSR-36S - 02XSR-36S 11.

0

A13KR13DA28W152B

A13KR13DA28W152B

JST

JUMPER 13DA-8M - 13KR-8M-P 6"

0

A08SSR08SSR32E254B

A08SSR08SSR32E254B

JST

JUMPER 08SSR-32H - 08SSR-32H 10"

0

A08XSR08XSR36R295A

A08XSR08XSR36R295A

JST

JUMPER HARNESS

0

A10SSR10SSR32E203B

A10SSR10SSR32E203B

JST

JUMPER 10SSR-32H - 10SSR-32H 8"

0

A11SSR11SSR32E152B

A11SSR11SSR32E152B

JST

JUMPER 11SSR-32H - 11SSR-32H 6"

0

A14SSR14SSR32E152B

A14SSR14SSR32E152B

JST

JUMPER 14SSR-32H - 14SSR-32H 6"

0

A16SUR16SUR32W305B

A16SUR16SUR32W305B

JST

JUMPER 15SUR-32S - 16SUR-32S 12"

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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