Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A03KR03KR26E203A

A03KR03KR26E203A

JST

JUMPER 03KR-6S-P - 03KR-6S-P 8"

170

A15SUR15SUR32W203B

A15SUR15SUR32W203B

JST

JUMPER 15SUR-32S - 15SUR-32S 8"

0

A01RARSFP16K102B

A01RARSFP16K102B

JST

JUMPER RARSFP-1V-00 & RARSFC-1V

0

A04XAF04XAF22K254B

A04XAF04XAF22K254B

JST

JUMPER 04XAF-2S - 04XAF-2S 10"

960

A20XAF20XAF22K254B

A20XAF20XAF22K254B

JST

JUMPER 20XAF-2S - 20XAF-2S 10"

1000

A02RSFP16K305K

A02RSFP16K305K

JST

JUMPER RSFP-2-LM 12"

0

A16KR16KR26E152B

A16KR16KR26E152B

JST

JUMPER 16KR-6S-P - 16KR-6S-P 6"

990

A22XSR22XSR36R102A

A22XSR22XSR36R102A

JST

JUMPER 22XSR-36S - 22XSR-36S 4"

990

A06XAF06XAF22K203A

A06XAF06XAF22K203A

JST

JUMPER 06XAF-2S - 06XAF-2S 8"

1000

A03DS03DS28W305B

A03DS03DS28W305B

JST

JUMPER 03DS-8E - 03DS-8E 12"

0

A02RSFR16K51K

A02RSFR16K51K

JST

JUMPER RSFR-2-LM 2"

0

A20XAF20XAF22K152A

A20XAF20XAF22K152A

JST

JUMPER 20XAF-2S - 20XAF-2S 6"

1000

A06XAF06XAF22K254A

A06XAF06XAF22K254A

JST

JUMPER 06XAF-2S - 06XAF-2S 10"

1000

A20XAF20XAF22K305A

A20XAF20XAF22K305A

JST

JUMPER 20XAF-2S - 20XAF-2S 12"

1000

A10ZR10ZR28H254A

A10ZR10ZR28H254A

JST

JUMPER 10ZR-8M-P - 10ZR-8M-P 10"

996

A08KR08DA28W152B

A08KR08DA28W152B

JST

JUMPER 08DA-8M - 08KR-8M-P 6"

178

A01RARSFP16K203A

A01RARSFP16K203A

JST

JUMPER RARSFP-1V-00 & RARSFC-1V

0

A13KR13KR26E305B

A13KR13KR26E305B

JST

JUMPER 13KR-6S-P - 13KR-6S-P 12"

966

A11KR11KR26E152B

A11KR11KR26E152B

JST

JUMPER 11KR-6S-P - 11KR-6S-P 6"

990

A02RSFP16K254K

A02RSFP16K254K

JST

JUMPER RSFP-2-LM 10"

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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