Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A09ZR09ZR28H254B

A09ZR09ZR28H254B

JST

JUMPER 09ZR-8M-P - 09ZR-8M-P 10"

985

A02DS02DS28W152B

A02DS02DS28W152B

JST

JUMPER 02DS-8E - 02DS-8E 6"

329

A10SUR10SUR32W254A

A10SUR10SUR32W254A

JST

JUMPER 10SUR-32S - 10SUR-32S 10"

856

A10ZR10ZR28H203B

A10ZR10ZR28H203B

JST

JUMPER 10ZR-8M-P - 10ZR-8M-P 8"

931

A04XSR04XSR36R102B

A04XSR04XSR36R102B

JST

JUMPER 04XSR-36S - 04XSR-36S 4"

826

A10SR10SR30K305A

A10SR10SR30K305A

JST

JUMPER 10SR-3S - 10SR-3S 12"

582

A13SR13SR30K305A

A13SR13SR30K305A

JST

JUMPER 13SR-3S - 13SR-3S 12"

989

A13KR13KR26E254A

A13KR13KR26E254A

JST

JUMPER 13KR-6S-P - 13KR-6S-P 10"

996

A06XSR06XSR36R254A

A06XSR06XSR36R254A

JST

JUMPER 06XSR-36S - 06XSR-36S 10"

524

A08ZR08ZR28H203A

A08ZR08ZR28H203A

JST

JUMPER 08ZR-8M-P - 08ZR-8M-P 8"

964

A03KR03KR26E305B

A03KR03KR26E305B

JST

JUMPER 03KR-6S-P - 03KR-6S-P 12"

787

A11KR11KR26E51B

A11KR11KR26E51B

JST

JUMPER 11KR-6S-P - 11KR-6S-P 2"

992

A06XAF06XAF22K152B

A06XAF06XAF22K152B

JST

JUMPER 06XAF-2S - 06XAF-2S 6"

1

A04KR04KR26E254A

A04KR04KR26E254A

JST

JUMPER 04KR-6S-P - 04KR-6S-P 10"

1065

A01RSFP16K305S

A01RSFP16K305S

JST

JUMPER RSFP-LP-1V-R-250 12"

0

A14SR14SR30K152A

A14SR14SR30K152A

JST

JUMPER 14SR-3S - 14SR-3S 6"

879

A04SR04SR30K102B

A04SR04SR30K102B

JST

JUMPER 04SR-3S - 04SR-3S 4"

1839

A03ZR03ZR28H305A

A03ZR03ZR28H305A

JST

JUMPER 03ZR-8M-P - 03ZR-8M-P 12"

4327

A04XSR04XSR36R203A

A04XSR04XSR36R203A

JST

JUMPER 04XSR-36S - 04XSR-36S 8"

455

A02XAF02XAF22K51A

A02XAF02XAF22K51A

JST

JUMPER 02XAF-2S - 02XAF-2S 2"

94

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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