Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
2153231041 Woodhead - Molex	MINIFIT JR SR M-S 4 CIRCUIT 150M	496
0151340305 Woodhead - Molex	PICOBLADE 3 CIRCUIT 450MM	0
0369220605 Woodhead - Molex	DITTO 6 CIRCUIT WTW 450MM	100
1451350403 Woodhead - Molex	MINI-FIT 4 CIRCUIT 300MM	47
2147552022 Woodhead - Molex	MICRO-FIT3.0 R-R 2 CIRCUIT 300MM	0
2174651031 Woodhead - Molex	ULTRA-FIT SR R-R 3CKT 150MM DISC	0
0151340803 Woodhead - Molex	PICOBLADE 8 CIRCUIT 300MM	1957
2174661063 Woodhead - Molex	ULTRA-FIT SR R-S 6CKT 600MM DISC	0
0151310200 Woodhead - Molex	CABLE-ASSY PICOLOCK 2 CIRCUIT 50	35
1451300803 Woodhead - Molex	NANO-FIT-TO-NANO-FIT OFF-THE-SHE	85
2153202062 Woodhead - Molex	MINIFIT JR SR R-R 6 CIRCUIT 300M	50
2153131043 Woodhead - Molex	MIZU-P25 P-S 4CKT 600MM SN	0
2162901013 Woodhead - Molex	STANDARD .093 1 CIRCUIT R TO R 6	0
0151340801 Woodhead - Molex	PICOBLADE 8 CIRCUIT 100MM	517
0369220805 Woodhead - Molex	DITTO 8 CIRCUIT WTW 450MM	100
0151350602 Woodhead - Molex	CLICKMATE 6 CIRCUIT 150MM	410
2162721052 Woodhead - Molex	SL POSITIVE LOCK P-P 5CKT 150MM	0
2153131021 Woodhead - Molex	MIZU-P25 P-S 2CKT 150MM SN	0
0369220603 Woodhead - Molex	DITTO 6 CIRCUIT WTW 300MM	85
2162731050 Woodhead - Molex	SL POSITIVE LOCK P-S 5CKT 50MM S	0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems