Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2162931011

2162931011

Woodhead - Molex

STANDARD .093 1 CIRCUIT P TO S 1

25

0451110602

0451110602

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 6-CKT

1065

0151350502

0151350502

Woodhead - Molex

CLICKMATE 5 CIRCUIT 150MM

0

0923150424

0923150424

Woodhead - Molex

4CCT. PICOFELX 240MM

0

2153251103

2153251103

Woodhead - Molex

MINIFIT JR DR R-R 10 CIRCUIT 600

250

0369200605

0369200605

Woodhead - Molex

PICOEZMATE 6 CIRCUIT 450MM

251

2147582063

2147582063

Woodhead - Molex

MICRO-FIT3.0 P-S 6 CIRCUIT 600MM

0

0369210300

0369210300

Woodhead - Molex

L1NK 396 3 CIRCUIT 75MM

243

2153251043

2153251043

Woodhead - Molex

MINIFIT JR DR R-R 4 CIRCUIT 600M

700

2153211021

2153211021

Woodhead - Molex

MINIFIT JR SR R-S 2 CIRCUIT 150M

149

0923150630

0923150630

Woodhead - Molex

6CKT PICOFLEX 300MM LONG

1199

2163301084

2163301084

Woodhead - Molex

EDGE LOCK R-R 8CKT 600MM SN

0

0151360703

0151360703

Woodhead - Molex

MICROCLASP 7 CIRCUIT 300MM

0

2153231052

2153231052

Woodhead - Molex

MINIFIT JR SR M-S 5 CIRCUIT 300M

75

2153231051

2153231051

Woodhead - Molex

MINIFIT JR SR M-S 5 CIRCUIT 150M

75

2153271023

2153271023

Woodhead - Molex

MINIFIT JR DR P-P 2 CIRCUIT 600M

1375

0151350801

0151350801

Woodhead - Molex

CLICKMATE 8CIRCUIT 100MM

0

2153232051

2153232051

Woodhead - Molex

MINIFIT JR SR M-S 5 CIRCUIT 150M

75

2153281082

2153281082

Woodhead - Molex

MINIFIT JR DR P-S 8 CIRCUIT 300M

0

1451320503

1451320503

Woodhead - Molex

MICRO-FIT TPA-TO-MICRO-FIT TPA O

1066

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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