Rectangular Cable Assemblies

Part Number	Description / PDF	Quantity
2162701032 Woodhead - Molex	SL POSITIVE LOCK R-R 3CKT 150MM	0
0369210600 Woodhead - Molex	L1NK 396 6 CIRCUIT 75MM	235
2162931042 Woodhead - Molex	STANDARD .093 4 CIRCUIT P TO S 3	0
0151330702 Woodhead - Molex	PICO-CLASP 7CIRCUIT 150MM	851
0151350405 Woodhead - Molex	CLICKMATE 4 CIRCUIT 450MM	0
0151340705 Woodhead - Molex	PICOBLADE 7 CIRCUIT 450MM	0
2147511022 Woodhead - Molex	MICROFIT 3.0 SR R-S 2CKT 300 MM	656
2162911011 Woodhead - Molex	STANDARD .093 1 CIRCUIT R TO S 1	0
1451320303 Woodhead - Molex	MICRO-FIT TPA-TO-MICRO-FIT TPA O	249
0151330803 Woodhead - Molex	PICO-CLASP 8 CIRCUIT 300MM	331
0451360201 Woodhead - Molex	MEGA-FIT 2 CIRCUIT 150MM	220
0923151601 Woodhead - Molex	16CKT PICOFLEX 1000MM LONG	0
0151341000 Woodhead - Molex	PICOBLADE 10 CIRCUIT 50MM	263
2174651043 Woodhead - Molex	ULTRA-FIT SR R-R 4CKT 600MM DISC	0
2166221031 Woodhead - Molex	SQUBA 3.6 P-P 3CKT 150MM SN	0
2451360210 Woodhead - Molex	MEGAFIT 2 CIRCUIT BLACK 1M OVERM	8
0369220206 Woodhead - Molex	DITTO 2 CIRCUIT WTW 600MM	2161
0451110306 Woodhead - Molex	MICROLOCK PLUS CABLE BLACK 3 CKT	627
2153251042 Woodhead - Molex	MINIFIT JR DR R-R 4 CIRCUIT 300M	0
1451350410 Woodhead - Molex	MINI-FIT 4 CIRCUIT 1M	1504

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
D-Subminiature	Metal-shielded, screw-locking design	Industrial computers, military equipment
IDC (Insulation Displacement)	Tool-less termination, flat cable compatibility	Telecom switches, HVAC systems
Board-to-Board	Low-profile, high-pin-count options	Servers, medical imaging devices
Ribbon Cable	Parallel signal routing, flexible dielectric	Computer peripherals, test equipment

3. Structure and Components

Typical construction includes:

Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
Shielding: Braided copper or conductive polymer layers
Strain relief: Molded thermoplastic overbraiding
Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

Parameter	Typical Range	Importance
Rated Voltage	50V - 600V	Ensures dielectric safety
Current Capacity	1A - 15A per contact	Determines power handling
Contact Resistance	5-20m	Impacts signal integrity
Insulation Resistance	100M - 10G	Prevents leakage currents
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500 - 5000 cycles	Durability indicator

5. Application Fields

Primary sectors include:

Computer & Peripherals: Server backplanes, GPU interconnects
Telecommunications: 5G base stations, optical network terminals
Industrial Automation: PLC interfaces, robotic controllers
Medical Equipment: MRI scanners, diagnostic devices
Transportation: EV battery management systems, avionics

6. Leading Manufacturers

Manufacturer	Key Products
Amphenol Corporation	D-Sub 90 PCB Mount Series
TE Connectivity	MATE-AX High-Speed Backplane Cables
Molex LLC	PicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.	QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

Electrical requirements (voltage/current profiles)
Mechanical constraints (space limitations, vibration exposure)
Environmental factors (temperature extremes, chemical exposure)
Signal integrity needs (impedance control, crosstalk reduction)
Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

Miniaturization: 0.4mm pitch connectors for mobile devices
High-speed capabilities: 25+ Gbps differential pair designs
Smart integration: Embedded sensors for condition monitoring
Sustainability focus: Halogen-free materials adoption
Automated manufacturing: AI-driven quality control systems