Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2153261043

2153261043

Woodhead - Molex

MINIFIT JR DR R-S 4 CIRCUIT 600M

0

2153271103

2153271103

Woodhead - Molex

MINIFIT JR DR P-P 10 CIRCUIT 600

0

0451330801

0451330801

Woodhead - Molex

ULTRAFIT 8 CIRCUIT BLACK 150MM

113

2153272083

2153272083

Woodhead - Molex

MINIFIT JR DR P-P 8 CIRCUIT 600M

0

0151321006

0151321006

Woodhead - Molex

CABLE ASSY PICOLOCK 10 POS 600MM

1759

2147562042

2147562042

Woodhead - Molex

MICRO-FIT3.0 R-S 4 CIRCUIT 300MM

25

2153201053

2153201053

Woodhead - Molex

MINIFIT JR SR R-R 5 CIRCUIT 600M

50

2162931043

2162931043

Woodhead - Molex

STANDARD .093 4 CIRCUIT P TO S 6

0

1451300303

1451300303

Woodhead - Molex

NANO-FIT-TO-NANO-FIT OFF-THE-SHE

915

0923150616

0923150616

Woodhead - Molex

6CKT PICOFLEX 160MM LONG

0

2162721062

2162721062

Woodhead - Molex

SL POSITIVE LOCK P-P 6CKT 150MM

0

2164011023

2164011023

Woodhead - Molex

MEGAFIT SR R-S 2 CKT 600 MM CABL

0

0151360202

0151360202

Woodhead - Molex

MICROCLASP 2 CIRCUIT 150MM

0

2166221023

2166221023

Woodhead - Molex

SQUBA 3.6 P-P 2CKT 600MM SN

0

2153231022

2153231022

Woodhead - Molex

MINIFIT JR SR M-S 2 CIRCUIT 300M

125

0151360702

0151360702

Woodhead - Molex

MICROCLASP 7 CIRCUIT 150MM

0

2147572022

2147572022

Woodhead - Molex

MICRO-FIT3.0 P-P 2 CIRCUIT 300MM

120

0369240210

0369240210

Woodhead - Molex

MINIFIT-SR 2 CIRCUIT 1000MM

272

2153101033

2153101033

Woodhead - Molex

MIZU-P25 R-R 3CKT 600MM SN

0

2162861041

2162861041

Woodhead - Molex

MX150 R-S DR 4CKT 150MM SN SEALE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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