Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
2153221032

2153221032

Woodhead - Molex

MINIFIT JR SR M-M 3 CIRCUIT 300M

75

2451300250

2451300250

Woodhead - Molex

2 CIRCUIT 5M NANOFIT OVERMOLDED

260

0151340505

0151340505

Woodhead - Molex

PICOBLADE 5 CIRCUIT 450MM

0

2153272022

2153272022

Woodhead - Molex

MINIFIT JR DR P-P 2 CIRCUIT 300M

0

2153201042

2153201042

Woodhead - Molex

MINIFIT JR SR R-R 4 CIRCUIT 300M

500

2147552061

2147552061

Woodhead - Molex

MICRO-FIT3.0 R-R 6 CIRCUIT 150MM

55

0451410310

0451410310

Woodhead - Molex

FCT 3 CKT CPA MULTICAT 1000MM AW

10

0151330203

0151330203

Woodhead - Molex

PICO-CLASP 2 CIRCUIT 300MM

120

0151310202

0151310202

Woodhead - Molex

CABLE-ASSY PICOLOCK 2 CIRCUIT 15

0

0451300803

0451300803

Woodhead - Molex

NANO-FIT 8CIRCUIT 300MM

592

0369220803

0369220803

Woodhead - Molex

DITTO 8 CIRCUIT WTW 300MM

100

2451300450

2451300450

Woodhead - Molex

4 CIRCUIT 5M NANOFIT OVERMOLDED

399

2153262041

2153262041

Woodhead - Molex

MINIFIT JR DR R-S 4 CIRCUIT 150M

0

2153202063

2153202063

Woodhead - Molex

MINIFIT JR SR R-R 6 CIRCUIT 600M

500

0923150608

0923150608

Woodhead - Molex

6CKT PICOFLEX 80MM LONG

0

0451300610

0451300610

Woodhead - Molex

NANO-FIT 6CIRCUIT 1M

380

2153202043

2153202043

Woodhead - Molex

MINIFIT JR SR R-R 4 CIRCUIT 600M

500

2151700601

2151700601

Woodhead - Molex

CABLE ASSY. 6 CKT PICO-CLASP 150

0

0923151620

0923151620

Woodhead - Molex

16CC PICOFLEX 200MM LONG

0

2162731082

2162731082

Woodhead - Molex

SL POSITIVE LOCK P-S 8CKT 150MM

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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